參數(shù)資料
型號: STA333ML13TR
廠商: 意法半導(dǎo)體
英文描述: Sound Terminal TM 2 channel microless high efficiency digital audio system
中文描述: 健全的終端TM 2號通道m(xù)icroless高效率數(shù)字音頻系統(tǒng)
文件頁數(shù): 12/15頁
文件大?。?/td> 185K
代理商: STA333ML13TR
Package thermal characteristics
STA333ML
12/15
6
Package thermal characteristics
A thermal resistance of 25 °C per Watt can be achieved using a ground copper area of
3 x 3 cm, and using 16 vias, on the PCB (see
Figure 7
). The amount of power dissipated
within the device depends primarily on the supply voltage, load impedance and output
modulation level.
The max estimated dissipated power for the STA333ML is 3 W. This gives, with the
suggested board copper area, a maximum
Tj of 75 °C. This gives a safety margin before
the thermal protection intervention is invoked (T
j
=150 °C) in consumer environments where
a 50 °C is the maximum ambient temperature.
Figure 7.
Thermal characteristic
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