參數(shù)資料
型號(hào): ST72F324BK2T6
廠(chǎng)商: STMICROELECTRONICS
元件分類(lèi): 微控制器/微處理器
英文描述: 8-BIT, FLASH, 8 MHz, MICROCONTROLLER, PQFP32
封裝: 7 X 7 MM, LQFP-32
文件頁(yè)數(shù): 31/167頁(yè)
文件大小: 2651K
代理商: ST72F324BK2T6
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Electrical characteristics
ST72323 ST72323L
126/167
11.7
EMC characteristics
Susceptibility tests are performed on a sample basis during product characterization.
11.7.1
Functional EMS (electromagnetic susceptibility)
Based on a simple running application on the product (toggling 2 LEDs through I/O ports),
the product is stressed by two electromagnetic events until a failure occurs (indicated by the
LEDs).
ESD: Electrostatic discharge (positive and negative) is applied on all pins of the device
until a functional disturbance occurs. This test conforms with the IEC 1000-4-2
standard.
FTB: A Burst of Fast Transient voltage (positive and negative) is applied to VDD and
VSS through a 100pF capacitor, until a functional disturbance occurs. This test
conforms with the IEC 1000-4-4 standard.
A device reset allows normal operations to be resumed. The test results are given in the
table below based on the EMS levels and classes defined in application note AN1709.
Designing hardened software to avoid noise problems
EMC characterization and optimization are performed at component level with a typical
application environment and simplified MCU software. It should be noted that good EMC
performance is highly dependent on the user application and the software in particular.
Therefore it is recommended that the user applies EMC software optimization and
prequalification tests in relation with the EMC level requested for his application.
Software recommendations:
The software flowchart must include the management of runaway conditions such as:
Corrupted program counter
Unexpected reset
Critical Data corruption (control registers...)
Prequalification trials:
Most of the common failures (unexpected reset and program counter corruption) can be
reproduced by manually forcing a low state on the Reset pin or the Oscillator pins for 1
second.
To complete these trials, ESD stress can be applied directly on the device, over the range of
specification values. When unexpected behavior is detected, the software can be hardened
to prevent unrecoverable errors from occurring (see application note AN1015)
.
Table 74.
EMS test results
Symbol
Parameter
Conditions
Level/Class(1)
1.
Design target value only.
VFESD
Voltage limits to be applied on any I/O pin
to induce a functional disturbance
VDD = 5 V, TA = +25 °C,
fOSC = 8 MHz conforms to
IEC 1000-4-2
4A
VFFTB
Fast transient voltage burst limits to be
applied through 100 pF on VDD and VDD
pins to induce a functional disturbance
VDD = 5 V, TA = +25 °C, fOSC =
8MHz
conforms to IEC 1000-4-4
4A
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ST72F324BK2T6TR 功能描述:8位微控制器 -MCU 5V RANGE 8B MCU RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線(xiàn)寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
ST72F324BK2TA 功能描述:8位微控制器 -MCU 8-bit MCU Flash RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線(xiàn)寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
ST72F324BK2TAE 功能描述:8位微控制器 -MCU 8B MCU 3.8 to 5.5V RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線(xiàn)寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
ST72F324BK2TATRE 制造商:STMicroelectronics 功能描述:
ST72F324BK4B6 功能描述:8位微控制器 -MCU 8 BITS MCU RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線(xiàn)寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT