參數(shù)資料
型號(hào): ST60-24P
廠商: Hirose Electric USA, INC.
英文描述: Interface Connectors for Miniature, Portable Terminal Devices
中文描述: 接口連接器的小型,便攜式終端設(shè)備
文件頁(yè)數(shù): 11/11頁(yè)
文件大小: 862K
代理商: ST60-24P
11
B
Recommended Temperature Profile (Lead-free soldering compound)
()
250
240
230
min
180
150
200
150
100
60S
30S
50
HRS test conditions
Solder composition: Paste, 96.5%Sn/3.0%Ag/0.5%Cu
Test board: Glass epoxy 35mm∞35mm∞0.8mm thick
The temperature profiles are based on the above conditions.
In individual applications the actual temperature may vary,
depending on solder paste type, volume/thickness and board
size/thickness. Consult your solder paste and equipment
manufacturer for specific recommendations.
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