參數(shù)資料
型號(hào)： ST10F269DIETR
廠商： STMICROELECTRONICS
元件分類(lèi)： 微控制器/微處理器
英文描述： 16-BIT, FLASH, 32 MHz, MICROCONTROLLER, UUC
封裝： DIE
文件頁(yè)數(shù)： 80/161頁(yè)
文件大小： 1595K
代理商： ST10F269DIETR
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ST10F269-T3
25/160
– Generally, command sequences cannot be
written to Flash by instructions fetched from the
Flash itself. Thus, the Flash commands must be
written by instructions, executed from internal
RAM or external memory.
– Command cycles on the CPU interface need not
to be consecutively received (pauses allowed).
The CPU interface delivers dummy read data for
not used cycles within command sequences.
– All addresses of command cycles shall be
defined only with Register-indirect addressing
mode in the according move instructions. Direct
addressing
is
not
allowed
for
command
sequences. Address segment or data page
pointer are taken into account for the command
address value.
5.3.7 - Reset Processing and Initial State
The Flash module distinguishes two kinds of CPU
reset types
The lengthening of CPU reset:
– Is
not
reported
to
external
devices
by
bidirectional pin
– Is not enabled in case of external start of CPU
after reset.
5.4 - Flash Memory Configuration
The
default
memory
configuration
of
the
ST10F269-T3 Memory is determined by the state
of the EA pin at reset. This value is stored in the
Internal ROM Enable bit (named ROMEN) of the
SYSCON register.
When ROMEN = 0, the internal Flash is disabled
and external ROM is used for startup control.
Flash memory can later be enabled by setting the
ROMEN
bit
of
SYSCON
to
1.
The
code
performing this setting must not run from a
segment of the external ROM to be replaced by a
segment
of
the
Flash
memory,
otherwise
unexpected behaviour may occur.
For example, if external ROM code is located in
the first 32K Bytes of segment 0, the first
32K Bytes of the Flash must then be enabled in
segment 1. This is done by setting the ROMS1 bit
of SYSCON to 0 before or simultaneously with
setting of ROMEN bit. This must be done in the
externally supplied program before the execution
of the EINIT instruction.
If program execution starts from external memory,
but access to the Flash memory mapped in
segment 0 is later required, then the code that
performs the setting of ROMEN bit must be
executed either in the segment 0 but above
address 00’8000h, or from the internal RAM.
Bit ROMS1 only affects the mapping of the first
32K Bytes of the Flash memory. All other parts of
the
Flash
memory
(addresses
01’8000h
-
04’FFFFh) remain unaffected.
The SGTDIS Segmentation Disable / Enable must
also be set to 0 to allow the use of the full
256K Bytes of on-chip memory in addition to the
external boot memory. The correct procedure on
changing the segmentation registers must also be
observed to prevent an unwanted trap condition:
– Instructions that configure the internal memory
must only be executed from external memory or
from the internal RAM.
– An
Absolute
Inter-Segment
Jump
(JMPS)
instruction
must
be
executed
after
Flash
enabling, to the next instruction, even if this next
instruction is located in the consecutive address.
– Whenever the internal Memory is disabled,
enabled or remapped, the DPPs must be
explicitly (re)loaded to enable correct data
accesses to the internal memory and/or external
memory.
5.5 - Application Examples
5.5.1 - Handling of Flash Addresses
All command, Block, Data and register addresses
to the Flash have to be located within the active
Flash memory space. The active space is that
address range to which the physical Flash
addresses are mapped as defined by the user.
When using data page pointer (DPP) for block
addresses make sure that address bit A15 and
A14 of the block address are reflected in both
LSBs of the selected DPPS.
Note: - For Command Instructions, address bit
A14, A15, A16 and A17 are don’t care.
This simplify a lot the application software,
because it minimizes the use of DPP regis-
ters when using Command in the Com-
mand Interface.
- Direct addressing is not allowed for
Command sequence operations to the
Flash. Only Register-indirect addressing
can be used for command, block or
write-data accesses.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ST10F269-DP 功能描述:16位微控制器 - MCU 16-bit MCU MAC 256 Kbyte Flash RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時(shí)鐘頻率:24 MHz 程序存儲(chǔ)器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
ST10F269-DPB 功能描述:16位微控制器 - MCU 16-bit MCU MAC 256 Kbyte Flash RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時(shí)鐘頻率:24 MHz 程序存儲(chǔ)器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
ST10F269-DPR 功能描述:16位微控制器 - MCU 16Bit MCU 256K BYTE FLASH,12K BYTE RAM RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時(shí)鐘頻率:24 MHz 程序存儲(chǔ)器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
ST10F269DT3 功能描述:16位微控制器 - MCU 16Bit MCU 256K BYTE FLASH,12K BYTE RAM RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時(shí)鐘頻率:24 MHz 程序存儲(chǔ)器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
ST10F269DTR3 功能描述:16位微控制器 - MCU 16-bit MCU MAC unit 256 Kbyte Flash RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時(shí)鐘頻率:24 MHz 程序存儲(chǔ)器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
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