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參數(shù)資料
| 型號： | ST-36BRP |
| 元件分類： | 晶閘管 |
| 英文描述： | 38 V, DIAC, DO-214 |
| 封裝： | ROHS COMPLIANT PACKAGE-2 |
| 文件頁數(shù)： | 5/8頁 |
| 文件大?。?/td> | 250K |
| 代理商： | ST-36BRP |
341
Please refer to http://www.littelfuse.com for current information.
Revised: July 9, 2008
Teccor
brand Thyristors
Standard Bidirectional DIAC Trigger
2008 Littelfuse, Inc.
Specifications are subject to change without notice.
HTxxx & HTMxxx & STxxx Series
D
Physical Specifications
Terminal Finish
100% Matte-Tin Plated/ Pb-Free Solder
Dipped
Body Material
DO-214: UL recognized epoxy meeting
flammabilty classification 94V-0.
DO-35/MINIMELF: Glass case body
Lead Material
DO-214: Copper Alloy
DO-35/MINIMELF: Copper Clad Iron
Reliability/Environmental Tests
Test
Specifications and Conditions
MIL-STD-750, M-1040, Cond A Applied
80% of Rated Min V
BO
(VAC-peak) @
125°C for 1008 hours
MIL-STD-750, M-1051,
100 cycles; -40°C to +150°C;
15-min dwell-time
EIA / JEDEC, JESD22-A101
1008 hours; 80% of Rated Min V
BO
(V
DC
):
85°C; 85%
rel humidity
MIL-STD-750, M-1031,1008 hours; 150°C
High Temperature
Voltage Blocking
Temperature Cycling
Temperature/
Humidity
High Temp Storage
Low-Temp Storage
1008 hours; -40°C
MIL-STD-750, M-1056
10 cycles; 0°C to 100°C; 5-min dwell
time at each temperature; 10 sec (max)
transfer time between temperature
EIA / JEDEC, JESD22-A102 168 hours
(121°C at 2 ATMs) and 100% R/H
Thermal Shock
Autoclave
Resistance to
Solder Heat
Solderability
MIL-STD-750 Method 2031
ANSI/J-STD-002, category 3, Test A
Lead Bend
MIL-STD-750, M-2036 Cond E
Burn-in
1 firing per 1/2 cycle, 168 hours
Dimensions – MINIMELF / SOD-80 (MM Package)
A
C
C
D
B
.002 E-F
E
F
Dimensions
Inches
Millimeters
Min
Typ
Max
Min
Typ
Max
A
0.125
0.134
0.142
3.18
3.40
3.61
B
0.066
0.068
0.070
1.68
1.73
1.78
C
0.012
0.018
0.020
0.30
0.46
0.51
D
—
0.063
—
—
1.60
—
Design Considerations
Dimensions – DO-35 (Y Package)
C
B
B
A
E
TYP
D (TYP)
Dimension
Inches
Millimeters
Min
Max
Min
Max
A
(Note 1)
0.060
0.090
1.530
2.280
B
(Note 2)
0.015
0.381
C
(Note 1)
0.135
0.165
3.430
4.190
D
0.018
0.022
0.458
0.558
E
1.000
25.400
Notes:
1. Package contour optional within dimensions A and C. Slugs, if any, shall be included
within this cylinger but shall not be subject to
the minimum limit of Dimention A.
2. Lead diameter is not controlled in this zone to allow for flash, lead finish build-up and
minor irregularities other than slugs.
Careful selection of the correct device for the application’s
operating parameters and environment will go a long
way toward extending the operating life of the Thyristor.
Overheating and surge currents are the main killers of
DIACs. Correct mounting, soldering, and forming of the
leads also help protect against component damage.
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