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參數(shù)資料
| 型號(hào)： | ST-32TH |
| 廠商： | Vishay Intertechnology,Inc. |
| 英文描述： | Surface Mount Cermet Trimmers (single turn) |
| 中文描述： | 表面貼裝金屬陶瓷司爐工（單轉(zhuǎn)） |
| 文件頁數(shù)： | 4/7頁 |
| 文件大?。?/td> | 380K |
| 代理商： | ST-32TH |
Document Number: 58009
Revision: 06-Mar-06
For technical questions contact: copalsupport@vishay.com
www.vishay.com
4
ST-32
Vishay
Surface Mount Cermet Trimmers (single turn)
MECHANICAL SPECIFICATIONS
250
°
(1 turn)
Operating torque
5 mN m {51 gf cm} maximum
Stop Strength
20 mN m {204 gf cm} minimum
100 cycles
[
Δ
R/R
≤
±
(
2
Ω
+ 3 %)]
Thrust to rotor
5 N {0.51 kgf} minimum
Sn-Pb: 235
°
C, 2 s
Sn-Cu (Lead (Pb)-free): 245 ±
3
°
C, 2
～
3 s
Shear (Adhesion)
5 N {0.51 kgf} 10 s
Substrate bending
Width 90 mm, bend 3 mm, 5 s, 1 time
Pull-off strength
5 N {0.51 kgf} 10 s
Mechanical turn
Rotational life
Solderability
ELECTRICAL CHARACTERISTICS
Nominal resistance
range
Resistance tolerance
Power ratings
Resistance law
Maximum input
voltage
Maximum wiper
current
Effective electrical
angle
End resistance
C.R.V.
Operating temp. range
10
Ω
～
2 M
Ω
±
20 %
0.125 W (70
°
C) 0 W (125
°
C)
Linear law (B)
DC200 V or power rating, whichever is
smaller
100 mA or power rating, whichever is
smaller
210
°
(1 turn)
1 % or 2
Ω
, whichever is greater
1 % or 3
Ω
, whichever is greater
- 55
～
125
°
C
10
Ω ～
50
Ω:
± 250
10
-6
/
°
C maximum
100
Ω
～
2 M
Ω:
± 100
10
-6
/
°
C maximum
1000 M
Ω
minimum (DC500 V)
AC500 V, 60 s
Approx. 0.05 g (ST-32A, B, EA, EB)
Approx. 0.11 g (ST-32G, H, EG, EH)
Temp. coefficient
Insulation resistance
Dielectric strength
Net weight
ENVIRONMENTAL SPECIFICATIONS
Test item
Test conditions
- 65
～
125
°
C (0.5 h),
5 cycles
- 10
～
65
°
C (Relative
humidity 80
～
98 %),
10 cycles, 240 h
981 m/s
2
, 6 ms
6 directions for 3 times
Specifications
[
Δ
R/R
≤
2 %]
[S.S.
≤
1 %]
Thermal shock
Humidity
[
Δ
R/R
≤
2 %]
Shock
each
[
Δ
R/R
≤
1 %]
[S.S.
≤
1 %]
Vibration
Amplitude 1.52 mm or
Acceleration 196 m/s
2,
10
～
2000 Hz,
3 directions, 12 times
each
Load Life
70
°
C, 0.125 W, 1000 h
[
Δ
R/R
≤
3 %]
[S.S.
≤
1 %]
Low
temperature
operation
High
temperature
exposure
- 55
°
C, 2 h
[
Δ
R/R
≤
2 %]
[S.S.
≤
2 %]
125
°
C, 250 h
[
Δ
R/R
≤
3 %]
[S.S.
≤
2 %]
Immersion seal
85
°
C, 60 s
No leaks (No
continuous bubbles)
Soldering heat
Sn-Pb
260
°
C, 10 s or 215
°
C,
35 s
S-Cu
Flow: 260
°
C ±
3
°
C as
the temperature in a pot
of molten solder,
immersion from head of
terminal to backside of
board, 5
～
6 s, two times
maximum
Reflow: Peak
temperature 255
°
C
(Please refer to the
profile below.)
Manual soldering:
350
± 10
°
C, 3
～
4 s
[
Δ
R/R
≤
1 %]
Reflo
w
profile for soldering heat e
v
al
u
ation
Reflo
w
: t
w
o times maxim
u
m
Peak : 250
O
v
er 230 °C
Pre Heating Zone
1
8
0°C
(°C)
250
200
150
100
50
150°C
90± 30 s
30± 10 s
Soldering Zone
Heating time
e
p
°C
+5
0
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