
Advance Information
2 Mbit / 3 Mbit / 4 Mbit / 8 Mbit Firmware Hub
SST49LF002A / SST49LF003A / SST49LF004A / SST49LF008A
19
2001 Silicon Storage Technology, Inc.
S71161-06-000
9/01
504
Absolute Maximum Stress Ratings
(Applied conditions greater than those listed under “Absolute Maximum
Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation
of the device at these conditions or conditions greater than those defined in the operational sections of this data
sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.)
Temperature Under Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C
D. C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to
V
DD
+0.5V
Transient Voltage (<20 ns) on Any Pin to Ground Potential
1
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . -2.0V to
V
DD
+2.0V
Package Power Dissipation Capability (Ta=25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W
Surface Mount Lead Soldering Temperature (3 Seconds). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240°C
Output Short Circuit Current
2
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
1. Do not violate processor or chipset limitations on the INIT# pin.
2. Outputs shorted for no more than one second. No more than one output shorted at a time. This note applies to non-PCI outputs.
O
PERATING
R
ANGE
Range
Commercial
Ambient Temp
0°C to +85°C
V
DD
3.0-3.6V
AC C
ONDITIONS
OF
T
EST
1
Input Rise/Fall Time . . . . . . . . . . . . . . . 3 ns
Output Load . . . . . . . . . . . . . . . . . . . . . C
L
= 30 pF
See Figures 24 and 25
1. FWH interface signals use PCI load test conditions
TABLE 11: DC O
PERATING
C
HARACTERISTICS
(A
LL
I
NTERFACE
)
Symbol
I
DD
Parameter
Power Supply Current
Limits
Max
Test Conditions
Address input=V
IL
/
V
IH
, at F=1/T
RC
Min,
V
DD
=V
DD
Max (PP Mode)
OE#=
V
IH
, WE#=
V
IH
OE#=
V
IH
, WE#=V
IL
, V
DD
=V
DD
Max (PP Mode)
FWH4=0.9V
DD
, f=33 MHz V
DD
=V
DD
Max, All
other inputs
≥
0.9 V
DD
or
≤
0.1 V
DD
FWH4=V
IL
, f=33 MHz V
DD
=V
DD
Max All other
inputs
≥
0.9 V
DD
or
≤
0.1 V
DD
V
IN
=GND to V
DD
, V
DD
=V
DD
Max
Min
Units
Read
Write
Standby V
DD
Current
(FWH Interface)
Ready Mode V
DD
Current
(FWH Interface)
Input Current for IC,
ID [3:0] pins
Input Leakage Current
Output Leakage Current
INIT# Input High Voltage
INIT# Input Low Voltage
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
12
24
100
mA
mA
μA
I
SB
I
RY1
1. The device is in Ready Mode when no activity is on the FWH bus.
2. Do not violate processor or chipset specification regarding INIT# voltage.
10
mA
I
I
200
μA
I
LI
I
LO
V
IHI2
V
ILI2
V
IL
V
IH
V
OL
V
OH
1
1
μA
μA
V
V
V
V
V
V
V
IN
=GND to V
DD
, V
DD
=V
DD
Max
V
OUT
=GND to V
DD
, V
DD
=V
DD
Max
V
DD
=V
DD
Max
V
DD
=V
DD
Min
V
DD
=V
DD
Min
V
DD
=V
DD
Max
I
OL
=1500μA, V
DD
=V
DD
Min
I
OH
=-500 μA, V
DD
=V
DD
Min
1.0
-0.5
-0.5
0.5 V
DD
V
DD
+0.5
0.4
0.3 V
DD
V
DD
+0.5
0.1 V
DD
0.9 V
DD
T11.8 504