• 參數(shù)資料
    型號: SST32HF1642-70-4E-LFSE
    廠商: SILICON STORAGE TECHNOLOGY INC
    元件分類: 存儲器
    英文描述: Multi-Purpose Flash Plus + SRAM ComboMemory
    中文描述: SPECIALTY MEMORY CIRCUIT, PBGA63
    封裝: 8 X 10 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, MO-210, LFBGA-63
    文件頁數(shù): 5/36頁
    文件大?。?/td> 414K
    代理商: SST32HF1642-70-4E-LFSE
    Preliminary Specifications
    Multi-Purpose Flash Plus + SRAM ComboMemory
    SST32HF1642 / SST32HF1682 / SST32HF3242 / SST32HF3282
    SST32HF1622C / SST32HF1642C / SST32HF3242C
    5
    2005 Silicon Storage Technology, Inc.
    S71253-03-000
    5/05
    Hardware Block Protection
    The SST32HFx2/x2C support top hardware block pro-
    tection, which protects the top 32 KWord block of the
    device. The Boot Block address ranges are described in
    Table 2. Program and Erase operations are prevented on
    the 32 KWord when WP# is low. If WP# is left floating, it
    is internally held high via a pull-up resistor, and the Boot
    Block is unprotected, enabling Program and Erase oper-
    ations on that block.
    Hardware Reset (RST#)
    The RST# pin provides a hardware method of resetting the
    device to read array data. When the RST# pin is held low
    for at least T
    RP
    any in-progress operation will terminate and
    return to Read mode. When no internal Program/Erase
    operation is in progress, a minimum period of T
    RHR
    is
    required after RST# is driven high before a valid Read can
    take place (see Figure 17).
    The Erase or Program operation that has been interrupted
    needs to be reinitiated after the device resumes normal
    operation mode to ensure data integrity.
    Flash Software Data Protection (SDP)
    The SST32HFx2/x2C provide the JEDEC approved soft-
    ware data protection scheme for all flash memory bank
    data alteration operations, i.e., Program and Erase. Any
    Program operation requires the inclusion of a series of
    three-byte sequence. The three byte-load sequence is
    used to initiate the Program operation, providing optimal
    protection from inadvertent Write operations, e.g., during
    the system power-up or power-down. Any Erase operation
    requires the inclusion of six-byte load sequence. The
    SST32HFx2/x2C devices are shipped with the software
    data protection permanently enabled. See Table 6 for the
    specific software command codes. During SDP command
    sequence, invalid commands will abort the device to Read
    mode, within T
    RC.
    The contents of DQ
    15
    -DQ
    8
    can be V
    IL
    or
    V
    IH,
    but no other value, during any SDP command
    sequence.
    SRAM Read
    The SRAM Read operation of the SST32HFx2/x2C is con-
    trolled by OE# and BES1#, both have to be low with WE#
    and BES2 high for the system to obtain data from the out-
    puts. BES1# and BES2 are used for SRAM bank selection.
    OE# is the output control and is used to gate data from the
    output pins. The data bus is in high impedance state when
    OE# is high. Refer to the Read cycle timing diagram, Fig-
    ure 3, for further details.
    SRAM Write
    The SRAM Write operation of the SST32HFx2/x2C is con-
    trolled by WE# and BES1#, both have to be low, BES2
    must be high for the system to write to the SRAM. During
    the Word-Write operation, the addresses and data are ref-
    erenced to the rising edge of either BES1#, WE#, or the
    falling edge of BES2 whichever occurs first. The write time
    is measured from the last falling edge of BES#1 or WE# or
    the rising edge of BES2 to the first rising edge of BES1#, or
    WE# or the falling edge of BES2. Refer to the Write cycle
    timing diagrams, Figures 4 and 5, for further details.
    Product Identification
    The Product Identification mode identifies the devices as
    the SST32HFx2/x2C and manufacturer as SST.
    This
    mode may be accessed by software operations only.
    The hardware device ID Read operation, which is typi-
    cally used by programmers, cannot be used on this
    device because of the shared lines between flash and
    SRAM in the multi-chip package. Therefore, applica-
    tion of high voltage to pin A
    9
    may damage this device.
    Users may use the software Product Identification opera-
    tion to identify the part (i.e., using the device ID) when using
    multiple manufacturers in the same socket. For details, see
    Tables 5 and 6 for software operation, Figure 14 for the
    software ID entry and read timing diagram and Figure 23
    for the ID entry command sequence flowchart.
    TABLE
    2: B
    OOT
    B
    LOCK
    A
    DDRESS
    R
    ANGES
    Product
    Top Boot Block
    SST32HF16x2x
    SST32HF32x2x
    Address Range
    0F8000H-0FFFFFH
    1F8000H-1FFFFFH
    T2.1 1253
    TABLE
    3: P
    RODUCT
    I
    DENTIFICATION
    Address
    0000H
    Data
    BFH
    Manufacturer’s ID
    Device ID
    SST32HF16x2x
    SST32HF32x2x
    0001H
    0001H
    234AH
    235AH
    T3.2 1253
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