參數(shù)資料
型號: SSL4101DB01
廠商: NXP Semiconductors N.V.
中文描述: Demoboard description Universal mains, input 90-305 Vac USB cable, power supply adaptor,CDROM (SPI software, datasheets, PCB layout-schematics, Quickstart guide)
文件頁數(shù): 9/11頁
文件大小: 103K
代理商: SSL4101DB01
AN10580_1
NXP B.V. 2008. All rights reserved.
Application note
Rev. 01 — 19 March 2008
9 of 11
NXP Semiconductors
AN10580
GreenChip TEA1761 SR and feedback controller
6.
Appendix
6.1 Layout considerations
The IC ground copper track should be as wide and as low ohmic as possible. The IC
ground is used as a reference for the circuits, but also has to conduct the high current of
the driver and the currents through the MOSFET C
dg
.
The IC ground is used as a reference for the voltage and current regulation and for the
control of the SR MOSFET. Therefore a compromise has to be made with respect to the
connection of the IC ground to the surrounding circuits. It is advisable to connect the IC
ground to the output electrolytic capacitor closest to the MOSFET source.
The SRSENSE pin must be connected as close as possible to the MOSFET drain pin to
guarantee a proper detection of the MOSFET V
DS
and thus control of the SR MOSFETs. It
is advisable to reserve a separate copper track in the PCB layout for this function.
6.2 Bill of materials
Table 1.
Relevant component values for a 19.5 V / 4.62 A application with the TEA1761.
Description
Resistor, SMD 0603 Thin Film Chip, 1 k
Ω
, 5 %
Resistor, SMD 0603 Thin Film Chip, 10 k
Ω
, 5 %
Resistor, SMD 0603 Thin Film Chip, 35.7 k
Ω
, 1 %
Resistor, SMD 0603 Thin Film Chip, 5.23 k
Ω
, 1 %
Resistor, SMD 1206 Thin Film Chip, 560
Ω
, 5 %
Resistor, SMD 0805 Thin Film Chip, 47
Ω
, 5 %
Resistor, SMD 0603 Thin Film Chip, 51 k
Ω
, 5 %
Resistor, Mu-Cu Wire, 10 m
Ω
, 1 %
MLCC, SMD 0805, 1
μ
F/50 V, Y5V
MLCC, SMD 0805, 0.01
μ
F/50 V, X7R
MLCC, SMD 0805, 470 pF/50 V, X7R
MLCC, SMD 0805, 2.2
μ
F/10 V, X7R
Bill of materials
Position
R30
R31, R39
R32
R33
R34, R35
R36, R37
R40
R42
C39
C31
C34
C35
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