
7. Outline Dimension
6
5
4
3
2
1
Front View
Package Outlines
Right View
Rear View
Package
Marking
(Cathode)
B3
Circuit Diagram
B2
B1
Blue
Anode
Blue
Anode
Blue
Cathode
2
5
6
1
Blue
Cathode
Blue
Cathode
Blue
Anode
3
4
Recommended
Solder Pad
* MATERIALS
PARTS
Package
MATERIALS
Heat-Resistant Polymer
Epoxy Resin
Ag Plating Copper Alloy
Encapsulating Resin
Electrodes
SEOUL SEMICONDUCTOR CO., LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : 82-2-2106-7305~6
- 6/9 -
SSC-MBT722
SSC-QP-7-03-08(REV.00)
( Tolerance:
±
0.2, Unit: mm )
( Tolerance:
±
0.2, Unit: mm )