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參數(shù)資料
| 型號： | SQE48T20120-PDB0G |
| 廠商： | POWER-ONE INC |
| 元件分類： | 電源模塊 |
| 英文描述： | 1-OUTPUT 240 W DC-DC REG PWR SUPPLY MODULE |
| 封裝： | ROHS COMPLIANT, ONE-EIGHTH BRICK PACKAGE-5 |
| 文件頁數(shù)： | 11/13頁 |
| 文件大?。?/td> | 434K |
| 代理商： | SQE48T20120-PDB0G |
MCD10157 Rev. 1.0, 12-May-10
www.power-one.com
Page 7 of 13
SQE48T20120 DC-DC Converter
36-75 VDC Input; 12 VDC @ 20 A Output
Preliminary Data Sheet
Characterization
General Information
The converter has been characterized for many
operational aspects, to include thermal derating
(maximum load current as a function of ambient
temperature and airflow), efficiency, startup and
shutdown parameters, output ripple and noise,
transient response to load step-change, overcurrent,
and short circuit.
The following pages contain specific plots or
waveforms associated with the converter. Additional
comments for specific data are provided below.
Test Conditions
All data presented were taken with the converter
soldered to a test board, specifically a 0.060” thick
printed wiring board (PWB) with four layers. The top
and bottom layers were not metalized. The two inner
layers, comprised of two-ounce copper, were used to
provide traces for connectivity to the converter.
The lack of metallization on the outer layers as well
as the limited thermal connection ensured that heat
transfer from the converter to the PWB was
minimized. This provides a worst-case but consistent
scenario for thermal derating purposes.
All measurements requiring airflow were made in the
vertical and horizontal wind tunnel using Infrared (IR)
thermography and thermocouples for thermometry.
Ensuring components on the converter do not
exceed their ratings is important to maintaining high
reliability. If one anticipates operating the converter
at or close to the maximum loads specified in the
derating curves, it is prudent to check actual
operating
temperatures
in
the
application.
Thermographic
imaging
is
preferable;
if
this
capability is not available, then thermocouples may
be used. The use of AWG #36 gauge thermocouples
is recommended to ensure measurement accuracy.
Careful routing of the thermocouple leads will further
minimize measurement error. Refer to Figure E for
the optimum measuring thermocouple location.
Thermal Derating – Air Cooled
Load current vs. ambient temperature and airflow
rates are given in Figures 1 - 3. Ambient temperature
was varied between 25°C and 85°C, with airflow
rates from 30 to 500LFM (0.15 to 2.5m/s).
For each set of conditions, the maximum load
current was defined as the lowest of:
(i) The output current at which any FET junction
temperature
does
not
exceed
a
maximum
temperature of 125°C as indicated by the thermal
measurement
(ii) The output current at which the temperature at
the thermocouple locations TC and TC1 do not exceed
125°C and 110°C respectively. (Figure E)
(iii) The nominal rating of the converter (20A/240W).
Fig. E: Locations of the thermocouples for thermal testing.
Thermal Derating – Baseplate Cooled (p/n: -xGxBx)
The maximum load current rating vs. baseplate
temperature is provided in Figure 4.
The ambient temperature was maintained ≤ 85°C,
with an airflow rate of ≤ 30LFM (≤ 0.15m/s).
Thermocouple measurements were maximized, as
above, to the following limits:
TC ≤ 125°C, TC1 ≤ 110°C & TB ≤ 105°C.
The user should design for TB ≤ 105°C.
Efficiency
Figure 5 shows the efficiency vs. load current plot for
ambient temperature (TA) of 25C, airflow rate of
300LFM (1.5m/s) with vertical mounting and input
voltages of 36V, 48V, 65V and 75V.
Power Dissipation
Figure 6 shows the power dissipation vs. load
current plot for TA=25C, airflow rate of 300LFM
(1.5m/s) with vertical mounting and input voltages of
36V, 48V, 65V and 75V.
Startup
Output voltage waveforms, during the turn-on
transient using the ON/OFF pin for full rated load
currents (resistive load) are shown with and without
external load capacitance in Figure 7 and Figure 8,
respectively.
Thermocouples (TC)
TC1
Thermocouple (TB)
Area
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