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參數(shù)資料
| 型號(hào)： | SPT1175ACP |
| 廠商： | SIGNAL PROCESSING TECHNOLOGIES |
| 元件分類： | ADC |
| 英文描述： | 1-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQCC28 |
| 封裝： | PLASTIC, LCC-28 |
| 文件頁(yè)數(shù)： | 8/8頁(yè) |
| 文件大?。?/td> | 76K |
| 代理商： | SPT1175ACP |
SPT
8
6/24/97
SPT1175
VRT
20
25
AGND
N/C
22
21
AVDD
19
VRTS
11
D6
10
D5
9
D4
8
N/C
7
D3
6
D2
5
D1
26
27
28
1
4
2
3
V
RBS
V
RB
DGND
N/C
DGND
D
OE
AGND
22
23
VIN
17
AV
DD
16
DV
D
14
CLK
13
DV
DD
12
D7
15
N/C
18
AV
DD
OE
DGND
D (LSB)
D1
D2
D3
D4
D5
D6
D7 (MSB)
DVDD
CLK
DGND
VRB
VRBS
AGND
VIN
AVDD
VRT
VRTS
AVDD
DVDD
PIN ASSIGNMENTS
DIP and
SOIC
PLCC
PIN FUNCTIONS
Name
Function
OE
Tri-State Output Enable
Tri-State When OE = DVDD,
Enable When
OE = DGND
DGND
Digital Ground
D0
Digital Output Data (LSB)
D1-6
Digital Output Data
D7
Digital Output Data (MSB)
DVDD
Digital Supply
CLK
CMOS Digital Clock Input
AVDD
Analog Supply
VRTS
Internal Self-Biased Reference Top
Shorted with VRT (pin 17). Generates 2.6 V.
VRT
Reference Resistor Top Side
VIN
Analog Input
AGND
Analog Ground
VRBS
Internal Self-Biased Reference Bottom
Shorted with VRB (pin 23). Generates 0.6 V.
VRB
Reference Resistor Bottom Side
ORDERING INFORMATION
PART NUMBER
TEMPERATURE RANGE
PACKAGE TYPE
SPT1175ACN
0 to +70
°C
24L Plastic Dip
SPT1175ACP
0 to +70
°C
28L PLCC
SPT1175ACS
0 to +70
°C
24L SOIC
SPT1175ACU
+25
°C
Die*
*See the die specification for guaranteed electrical performance.
Signal Processing Technologies, Inc. reserves the right to change products and specifications without notice. Permission is hereby expressly
granted to copy this literature for informational purposes only. Copying this material for any other use is strictly prohibited.
WARNING - LIFE SUPPORT APPLICATIONS POLICY - SPT products should not be used within Life Support Systems without the specific
written consent of SPT. A Life Support System is a product or system intended to support or sustain life which, if it fails, can be reasonably
expected to result in significant personal injury or death.
Signal Processing Technologies believes that ultrasonic cleaning of its products may damage the wire bonding, leading to device
failure. It is therefore not recommended, and exposure of a device to such a process will void the product warranty.
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