參數(shù)資料
型號(hào)： SPC5634MF1MLQ80
廠商： Freescale Semiconductor
文件頁數(shù)： 81/122頁
文件大?。?/td> 0K
描述： IC MCU FLASH 1.5M 94K 144-LQFP
標(biāo)準(zhǔn)包裝： 60
系列： MPC56xx Qorivva
核心處理器： e200z3
芯體尺寸： 32-位
速度： 80MHz
連通性： CAN，EBI/EMI，LIN，SCI，SPI，UART/USART
外圍設(shè)備： DMA，POR，PWM，WDT
輸入/輸出數(shù)： 114
程序存儲(chǔ)器容量： 1.5MB（1.5M x 8）
程序存儲(chǔ)器類型： 閃存
RAM 容量： 94K x 8
電壓 - 電源 (Vcc/Vdd)： 4.5 V ~ 5.25 V
數(shù)據(jù)轉(zhuǎn)換器： A/D 32x12b
振蕩器型： 內(nèi)部
工作溫度： -40°C ~ 150°C
封裝/外殼： 144-LQFP
包裝： 托盤
Electrical characteristics
MPC5634M Microcontroller Data Sheet, Rev. 9
Freescale Semiconductor
61
The thermal resistance is expressed as the sum of a junction-to-case thermal resistance plus a case-to-ambient thermal
resistance:
RJA = RJC + RCA
Eqn. 3
where:
RJA = junction-to-ambient thermal resistance (oC/W)
RJC = junction-to-case thermal resistance (oC/W)
RCA = case to ambient thermal resistance (oC/W)
RJC is device related and is not affected by other factors. The thermal environment can be controlled to change the
case-to-ambient thermal resistance, RCA. For example, change the air flow around the device, add a heat sink, change the
mounting arrangement on the printed circuit board, or change the thermal dissipation on the printed circuit board surrounding
the device. This description is most useful for packages with heat sinks where 90% of the heat flow is through the case to heat
sink to ambient. For most packages, a better model is required.
A more accurate two-resistor thermal model can be constructed from the junction-to-board thermal resistance and the
junction-to-case thermal resistance. The junction-to-case thermal resistance describes when using a heat sink or where a
substantial amount of heat is dissipated from the top of the package. The junction-to-board thermal resistance describes the
thermal performance when most of the heat is conducted to the printed circuit board. This model can be used to generate simple
estimations and for computational fluid dynamics (CFD) thermal models.
To determine the junction temperature of the device in the application on a prototype board, use the thermal characterization
parameter (
JT) to determine the junction temperature by measuring the temperature at the top center of the package case using
the following equation:
TJ = TT + (JT x PD)
Eqn. 4
where:
TT = thermocouple temperature on top of the package (oC)
JT = thermal characterization parameter (oC/W)
PD = power dissipation in the package (W)
The thermal characterization parameter is measured in compliance with the JESD51-2 specification using a 40-gauge type T
thermocouple epoxied to the top center of the package case. Position the thermocouple so that the thermocouple junction rests
on the package. Place a small amount of epoxy on the thermocouple junction and approximately 1 mm of wire extending from
the junction. Place the thermocouple wire flat against the package case to avoid measurement errors caused by the cooling
effects of the thermocouple wire.
References:
Semiconductor Equipment and Materials International
3081 Zanker Road
San Jose, CA 95134
USA
(408) 943-6900
MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering Documents at 800-854-7179 or
303-397-7956.
JEDEC specifications are available on the web at http://www.jedec.org.
C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an Automotive Engine
Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47-54.
G. Kromann, S. Shidore, and S. Addison, “Thermal Modeling of a PBGA for Air-Cooled Applications”, Electronic
Packaging and Production, pp. 53-58, March 1998.
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SPC5634MF1MLU60 功能描述:32位微控制器 - MCU 1.5M FLASH 94K RAM RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:90 MHz 程序存儲(chǔ)器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT
SPC5634MF1MLU80 功能描述:32位微控制器 - MCU 1.5M FLASH 94K RAM RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:90 MHz 程序存儲(chǔ)器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT
SPC5634MF1MMG60 功能描述:32位微控制器 - MCU 1.5M FLASH 94K RAM RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:90 MHz 程序存儲(chǔ)器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT
SPC5634MF1MMG80 功能描述:32位微控制器 - MCU 1.5M Flash,94K RAM RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:90 MHz 程序存儲(chǔ)器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT
SPC5634MF2MLQ80 制造商:Freescale Semiconductor 功能描述:SPC5634MF2MLQ80 - Bulk
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