參數(shù)資料
型號: SP723AB
廠商: Littelfuse, Inc.
英文描述: TVS Diode Arrays - Electronic Protection Array for ESD and Overvoltage Protection
中文描述: 抑制二極管陣列- ESD和過電壓保護(hù)電子保護(hù)陣列
文件頁數(shù): 2/6頁
文件大?。?/td> 255K
代理商: SP723AB
241
www.littelfuse.com
5
T
TVS Diode Arrays
SP723
Electronic Protection Array for ESD and Overvoltage Protection
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device.This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1.
θ
JAis measured with the component mounted on an evaluation PC board in free air.
Electrical Specification
TA=40
o
C to 105
o
C, VIN= 0.5VCC, Unless Otherwise Specified
Absolute Maximum Ratings
Continuous Supply Voltage, (V+) - (V-). . . . . . . . . . . . . . . . . . . . . . . . . +35V
Forward Peak Current, IINto VCC, IINto GND
(Refer to Figure 6). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±4A, 100μs
Peak Pulse Current, 8/20μs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±7A
ESD Ratings and Capability (Figure 1, Table 1)
Load Dump and Reverse Battery (Note 2)
Thermal Information
Thermal Resistance (Typical, Note 1)
θ
JA(
o
C/W)
PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .160
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170
Storage Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65
o
C to 150
o
C
Maximum Junction Temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150
o
C
Lead Temperature (Soldering 10s). . . . . . . . . . . . . .. . . . . . . . . . . . . . 300
o
C
(SOIC - Lead Tips Only)
ESD Capability
ESD capability is dependent on the application and defined test
standard.The evaluation results for various test standards and methods
based on Figure 1 are shown in Table 1.
The SP723 has a Level 4 HBM capability when tested as a device to the
IEC 61000-4-2 standard. Level 4 specifies a required capability greater
than 8kV for direct discharge and greater than 15kV for air discharge.
For the “Modified” MIL-STD-3015.7 condition that is defined as an “in-
circuit” method of ESD testing, the V+ and V- pins have a return path to
ground and the SP723 ESD capability is typically greater than 25kV from
100pF through 1.5k
. By strict definition of MIL-STD-3015.7 using “pin-
to-pin” device testing, the ESD voltage capability is greater than 10kV.
For the SP723 EIAJ IC121 Machine Model (MM) standard, the ESD capa-
bility is typically greater than 2kV from 200pF with no series resistance.
STANDARD
TYPE/MODE
R
D
C
D
±
V
D
IEC 1000-4-2
(Level 4)
HBM, Air Discharge
330
150pF
15kV
HBM, Direct Discharge
330
150pF
8kV
MIL-STD-3015.7 Modified HBM
1.5k
100pF
25kV
Standard HBM
1.5k
100pF
10kV
EIAJ IC121
Machine Model
0k
200pF
2kV
H.V.
SUPPLY
°±
V
D
IN
DUT
C
D
R
1
IEC 1000-4-2: R
1
50 to 100M
MIL-STD-3015.7: R
1
1 to 10M
R
D
CHARGE
SWITCH
DISCHARGE
SWITCH
FIGURE 1. ELECTROSTATIC DISCHARGE TEST
TABLE 1. ESD TEST CONDITIONS
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