參數(shù)資料
型號(hào): SP6338EK1-L-Z-D-B/TR
元件分類: 電源管理
英文描述: 1-CHANNEL POWER SUPPLY MANAGEMENT CKT, PDSO8
封裝: LEAD FREE, MO-193BA, TSOT-8
文件頁(yè)數(shù): 25/33頁(yè)
文件大?。?/td> 1431K
代理商: SP6338EK1-L-Z-D-B/TR
Reliability Report: SP6330
April 7, 2006
Page 3 of 5
Package Information:
Package Type:
8 pin TSOT
Die Size:
45 x 67 mil
Reliability Qualification Test Summary:
Stress Level
Device
Burn-In Temp
Sample Size
No. Fail
168Hrs
SP6330
125
°C
240
0
500Hrs
SP6330
125
°C
240
0
1000Hrs
SP6330
125
°C
240
0
Life Test
Life testing is conducted to determine if there are any fundamental reliability related
failure mechanism(s) present in the device.
These failure mechanisms can be divided roughly into four groups:
1.
Process or die related failures, such as oxide-related defects, metalization-related
defects and diffusion-related defects.
2.
Assembly-related defects such as chip mount wire bond or package-related
failures.
3.
Design related defects.
4.
Miscellaneous, undetermined or application- induced failures.
Life Test Results
As part of the Sipex design qualification program, the Engineering group had subjected
80 parts from each of 3 lots of SP6330 for a 1000 hour reliability life test at 125° C.
168 hour Life test
240 parts of SP6330 parts were subjected to the life test profile and completed
168hr the test without any part failures.
500 hour Life test
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