參數(shù)資料
型號: SP4425UEB
英文描述: Electroluminescent Lamp Driver Low Voltage Applications
中文描述: 電致發(fā)光燈驅(qū)動器低電壓應(yīng)用
文件頁數(shù): 3/14頁
文件大小: 176K
代理商: SP4425UEB
SP4425DS/20
SP4425 Electroluminescent Lamp Driver
3
Copyright 2000 Sipex Corporation
(T= 25
°
C; V
DD
= 3.0V; Lamp Capacitance = 4nF with 100
Series resistance; Coil = 2mH/44ohms; C
OSC
= 180pF, C
INT
= 470pF unless otherwise noted)
V
SS
HON
D1
Coil
C
OSC
73 x 46
MS666
EL2
V
DD
EL1
NOTES:
1. Dimensions are in Microns unless otherwise noted.
2. Bonding pads are 125x125 typical.
3. Outside dimensions are maximum, including scribe area.
4. Die thickness is 10 mils +/- 1.
5. Pad center coordinates are relative to die center.
6. Die size 74 x 44 mils.
This data sheet specifies environmental parameters, final test conditions and limits as well suggested operating conditions.
For applications which require performance beyond the specified condition and or limits please consult the factory.
Bonding Diagram:
PAD
V
DD
X
Y
261.0
813.0
813.0
813.0
767.0
143.5
-790.0
-785.5
427.0
429.0
28.0
-172.0
-381.0
-412.0
-157.5
402.0
EL1
EL2
D1
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