參數(shù)資料
型號(hào): SP3222EBCA-L/TR
廠商: Exar Corporation
文件頁(yè)數(shù): 12/22頁(yè)
文件大?。?/td> 0K
描述: IC TXRX RS232 ESD TRUE 20SSOP
標(biāo)準(zhǔn)包裝: 1,500
類型: 收發(fā)器
驅(qū)動(dòng)器/接收器數(shù): 2/2
規(guī)程: RS232
電源電壓: 3 V ~ 5.5 V
安裝類型: 表面貼裝
封裝/外殼: 20-SSOP(0.209",5.30mm 寬)
供應(yīng)商設(shè)備封裝: 20-SSOP
包裝: 帶卷 (TR)
2
Exar Corporation 48720 Kato Road, Fremont CA, 94538 510-668-7017 www.exar.com
SP3222EB/SP3232EB_102_031413
NOTE 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V.
These are stress ratings only and functional operation
of the device at these ratings or any other above those
indicated in the operation sections of the specifications
below is not implied. Exposure to absolute maximum
rating conditions for extended periods of time may
affect reliability and cause permanent damage to the
device.
V
CC.......................................................-0.3V to +6.0V
V+ (NOTE 1).......................................-0.3V to +7.0V
V- (NOTE 1)........................................+0.3V to -7.0V
V+ + |V-| (NOTE 1)...........................................+13V
I
CC (DC VCC or GND current).........................+100mA
Input Voltages
TxIN, EN..............................................-0.3V to +6.0V
RxIN...................................................................+15V
Output Voltages
TxOUT.............................................................+13.2V
RxOUT, .......................................-0.3V to (V
CC +0.3V)
Short-Circuit Duration
TxOUT....................................................Continuous
Storage Temperature......................-65°C to +150°C
Unless otherwise noted, the following specifications apply for V
CC = +3.0V to +5.5V with TAMB = TMIN to TMAX,
C1 - C4 = 0.1F.
Power Dissipation per package
20-pin SSOP (derate 9.25mW/oC above +70oC)..............750mW
18-pin SOIC (derate 15.7mW/oC above +70oC)..............1260mW
20-pin TSSOP (derate 11.1mW/oC above +70oC).............890mW
16-pin SSOP (derate 9.69mW/oC above +70oC)...............775mW
16-pin Wide SOIC (derate 11.2mW/oC above +70oC)........900mW
16-pin TSSOP (derate 10.5mW/oC above +70oC)..............850mW
16-pin nSOIC (derate 13.57mW/oC above +70oC)...........1086mW
ELECTRICAL CHARACTERISTICS
PARAMETER
MIN.
TYP.
MAX. UNITS CONDITIONS
DC CHARACTERISTICS
Supply Current
0.3
1.0
mA
no load, V
CC = 3.3V,
T
AMB = 25
o
C, TxIN = GND or V
CC
Shutdown Supply Current
1.0
10
A
SHDN = GND, VCC = 3.3V,
T
AMB = 25
o
C, TxIN = Vcc or GND
LOGIC INPUTS AND RECEIVER OUTPUTS
Input Logic Threshold LOW
GND
0.8
V
TxIN, EN, SHDN, Note 2
Input Logic Threshold HIGH
2.0
Vcc
V
Vcc = 3.3V, Note 2
Input Logic Threshold HIGH
2.4
Vcc
V
Vcc = 5.0V, Note 2
Input Leakage Current
+0.01
+1.0
A
TxIN, EN, SHDN,
T
AMB = +25
o
C, V
IN = 0V to VCC
Output Leakage Current
+0.05
+10
A
Receivers disabled, V
OUT = 0V to VCC
Output Voltage LOW
0.4
V
I
OUT = 1.6mA
Output Voltage HIGH
V
CC -0.6
V
CC -0.1
V
I
OUT = -1.0mA
DRIVER OUTPUTS
Output Voltage Swing
+5.0
+5.4
V
All driver outputs loaded with 3k to
GND, T
AMB = +25
o
C
NOTE 2: Driver Input hysteresis is typically 250mV.
ABSOLUTE MAXIMUM RATINGS
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