Rev. 6/30/03 SP3222B/3232B True +3.0 to +5.5V RS-232 Transceivers
Copyright 2003 Sipex Corporation
2
NOTE 1:
V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V.
NOTE 2:
Driver Input hysteresis is typically 250mV.
ABSOLUTE MAXIMUM RATINGS
These are stress ratings only and functional
operation of the device at these ratings or any other
above those indicated in the operation sections of
the specifications below is not implied. Exposure to
absolute maximum rating conditions for extended
periods of time may affect reliability and cause
permanent damage to the device.
V
...................................................... -0.3V to +6.0V
V+ (NOTE 1) ...................................... -0.3V to +7.0V
V- (NOTE 1) ....................................... +0.3V to -7.0V
V+ + |V-| (NOTE 1)...........................................+13V
I
CC
(DC V
CC
or GND current).........................
±
100mA
Input Voltages
TxIN, EN ............................................ -0.3V to +6.0V
RxIN ..................................................................
±
25V
Output Voltages
TxOUT ...........................................................
±
13.2V
RxOUT ..................................... -0.3V to (V
CC
+ 0.3V)
Short-Circuit Duration
TxOUT .................................................... Continuous
Storage Temperature ...................... -65
°
C to +150
°
C
Power
Dissipation
20-pin SSOP (derate 9.25mW/
o
C above +70
o
C)........750mW
18-pin PDIP (derate 15.2mW/
o
C above +70
o
C) .......1220mW
18-pin SOIC (derate 15.7mW/
o
C above +70
o
C) ....... 1260mW
20-pin TSSOP (derate 11.1mW/
o
C above +70
o
C)...... 890mW
16-pin SSOP (derate 9.69mW/
o
C above +70
o
C)........775mW
16-pin PDIP (derate 14.3mW/
o
C above +70
o
C) .......1150mW
16-pin Wide SOIC (derate 11.2mW/
o
C above +70
o
C) .... 900mW
16-pin TSSOP (derate 10.5mW/
o
C above +70
o
C)...... 850mW
16-pin nSOIC (derate 13.57mW/
°
C above +70
°
C) ...... 1086mW
Per
Package
SPECIFICATIONS
Unless otherwise noted, the following specifications apply for V
CC
= +3.0V to +5.5V with T
AMB
= T
MIN
to T
MAX
, C
1
to
C
4
=0.1
μ
F
PARAMETER
MIN.
TYP.
MAX.
UNITS
CONDITIONS
DC CHARACTERISTICS
Supply Current
0.3
1.0
mA
no load, T
AMB
= +25
°
C, V
CC
= 3.3V,
TxIN = V
CC
SHDN = GND, T
= +25
°
C,
V
CC
= +3.3V, TxIN = V
CC
or GND
Shutdown Supply Current
1.0
10
μ
A
LOGIC INPUTS AND RECEIVER OUTPUTS
Input Logic Threshold LOW
0.8
V
TxIN, EN, SHDN, Note 2
Input Logic Threshold HIGH
2.0
2.4
V
V
V
CC
= 3.3V, Note 2
V
CC
= 5.0V, Note 2
TxIN, EN, SHDN, T
AMB
= +25
°
C,
V
IN
= 0V to V
CC
receivers disabled, V
OUT
= 0V to V
CC
I
OUT
= 1.6mA
I
OUT
= -1.0mA
Input Leakage Current
±
0.01
±
1.0
μ
A
Output Leakage Current
±
0.05
±
10
0.4
μ
A
V
Output Voltage LOW
Output Voltage HIGH
V
CC
-0.6
V
CC
-0.1
V
DRIVER OUTPUTS
Output Voltage Swing
±
5.0
±
5.4
V
3k
load to ground at all driver
outputs, T
AMB
= +25
°
C
V
CC
= V+ = V- = 0V, T
OUT
= +2V
V
OUT
= 0V
V
=
±
12V,V
= 0V,
or 3.0V to 5.5V, drivers disabled
Output Resistance
300
mA
Output Short-Circuit Current
±
35
±
60
±
25
Output Leakage Current
μ
A