
Parameter
Specification
Test Method
Capacitance
Within tolerance specified in
the part number
Class (I)
C<30 pF: Q
≥
400+20xC
C30 pF: Q>1000
Class (II)
X7R: DF
≤
3%, Z5U:
DF
≤
3%, Y5V: DF
≤
5%
C
≤
50,000 IR: >10 G Ohms
C
≤
50,000 IR: >500 Ohms.F
Class (I)
C
≤
1000 pF: 1 MHz. ±10%
0.5 to 5 V rms
C>1000 pF: 1 KHz. ±10%
1.0 ±0.2 V rms
Class (II)
1 KHz. ±10%, 1.0 ±0.2 V rms
Dissipation Factor
(Tan d and Q)
Insulation Resistance
(IR)
Apply rated voltage fro 60
seconds at room temperature
and normal humidity
(70% max.)
Apply rated voltage (Class I) or
2.5 x rated voltage (Class II) to
both terminations for 5
seconds. Charge and
discharge current are less hat
50 mA.
After soldering capacitor on
the glass-epoxy PWB, 50 gms
of steady pull is applied in
direction of arrow for 10
seconds. ( See Figure 1)
After soldering capacitor on
the glass-epoxy PWB, 2 mm
of bending shall be applied for
10 seconds as shown in the
drawing. ( See Figure 2)
Dielectric
Withstanding Voltage
There shall be no evidence
of damage or flash over
during the test.
Termination
Adherence
No mechanical damage
Bend Strength
No mechanical damage
Life Test (High
Temperature Loading
test) - Capacitance
Change
Class (I):
No more than ±3% or ±0.3
pf which ever is more.
Class (II):
X7R: ±10% max.
Z5U, Y5V: ±30% max.
Class (I)
C<10 pF: Q
≥
200+10xC
10 pF
≤
C < 30 pF
Q
≥
275+2xC:
C>30 pF: Q>350
Class (II)
X7R: DF
≤
5%
Z5U & Y5V: DF
≤
7.5%
1000 M Ohms or 50 Ohms.F
whichever is less
Apply 2 x rated voltage at
maximum operating
temperature for 1000 hours.
The surge current shall not
exceed 50 mA. After this, the
samples shall be kept in room
temperature for 24 hours
(Class I) or 48 hours (class II)
and then measured for the
parameters indicated.
Life Test (High
Temperature Loading
test) - DF or Q
Life Test (High
Temperature Loading
test) - IR
Parameter
Moisture Resistance
Test - Capacitance
change
Specification
Class (I):
No more than ±5% or ±0.5 pf
which ever is more.
Class (II):
X7R: ±10% max.
Z5U & Y5V: ±30% max.
Class (I)
C<10 pF: Q
≥
200+10xC
10 pF
≤
C < 30 pF
Q
≥
275+2xC:
C
≥
30 pF: Q
≥
350
Class (II)
X7R: DF
≤
5%
Z5U & Y5V: DF
≤
7.5%
1000 M Ohms or 50 Ohms.F
whichever is less
Class (I):
No more than ±7.5% or ±0.75
pf which ever is more.
Class (II):
X7R: ±12.5% max.
Z5U, Y5V: ±30% max.
Class (I)
C<30 pF: Q
≥
100+3xC
C
≥
30 pF: Q
≥
200
Class (II)
X7R: DF
≤
5%
Z5U & Y5V: DF
≤
7.5%
500 M Ohms or 25 Ohms.F
whichever is less
Class (I):
No more than ±2.5% or ±0.25
pf which ever is more.
Class (II):
X7R: ±7.5% max.
Z5U, Y5V: ±20% max.
Parts to meet the initial
specifications
Parts to meet the initial
specifications
Test Method
The capacitor shall be
subjected to 40 °C and 90 to
95% RH for 500 hours. After this,
samples shall be
kept in room temperature for
24 hrs. (Class I) or 48 hrs.
(Class II), and them shall be
measured (Class I) or 48
hours (Class II) and then
measured for the parameters
indicated.
Moisture Resistance
Test - Q or DF
Moisture Resistance
Test - IR
Humidity Load Test -
Capacitance change
The capacitor shall be
subjected to rated voltage at
40 °C and 90 to 95 % RH for
500 hours. Surge current shall
not exceed 50 mA. After this,
samples shall be kept in room
temperature for 24 hrs. (Class I)
or 48 hours (Class II), and
them shall be measured
(Class I) or 48 hours (Class II)
and then measured for the
parameters indicated.
Humidity Load Test
Q or DF
Humidity Load Test -
IR
Temperature Cycling
Test - Capacitance
change
Perform 5 cycles as follows:
1. Room temperature dwell for
15 minutes.
2. Minimum operating
temperature dwell for 30
minutes.
3. Room temperature dwell for
30 minutes.
4. Maximum operating
temperature dwell for 30
minutes.
After the above testing
condition, samples shall be
kept in room temperature for
24 hrs. (Class I) or 48 hours
(Class II), and them shall be
measured (Class I) or 48 hours
(class II) and then measured
for the parameters indicated.
The capacitors are completely
immersed for
10
±0.5 seconds
in the molten solder with a
temperature of 2
6
0±5°C solder.
Temperature Cycling
Test - Q or DF
Temperature Cycling
Test - IR
Solderability
Termination area shall be at
least 75% covered with a new
solder coating. There shall be
no crack and ceramic
exposure of terminated
Cladding material of outer-
surface due to melting.
electrode: Sn (~100%)
No more than ±2.5% or ±0.25
pf which ever is more.
Class (II):
X7R: ±7.5% max.
Z5U, Y5V: ±20% max.
Parts to meet the initial
specifications
Parts to meet the initial
specifications
Resistance to Solder
Heat Test -
Capacitance Change
The capacitors are completely
immersed for 10 ±1.0 seconds
in the molten solder with a
temperature of 270±5°C solder.
Preheat before immersion,
1. 80 to 100 °C for 2 minutes
2. 150 to 180 °C for 2 minutes
The capacitance measurement
shall be made after the
samples have been kept at
room temperature for 24 hours.
Resistance to Solder
Heat Test - Q or DF
Resistance to Solder
Heat Test - IR
Figure 1
Figure 2
Reliability and Test Conditions
First symbol
(a letter)
Z
Y
X
Second symbol
(a number)
2
4
5
6
7
Third Symbol
(a letter)
A
B
C
D
E
F
P
R
S
T
U
V
+10 deg. C
-30 deg. C
-55 deg. C
+45 deg. C
+65 deg. C
+85 deg. C
+105 deg. C
+125 deg. C
+1.0%
+/- 1.5%
+/- 2.2%
+/- 3.3%
+/- 4.7%
+/- 7.5%
+/- 10.0%
+/- 15.0%
+/- 22.0%
+22%, -33%
+22%, -56%
+22%, -82%
Class II Dielectric Code Explanation
Low temperature
requirement
High Temperature
requirement
MAX. Capacitance change over
temperature
Sharma Ceramic Capacitors
Page 3
Tel: (949)642-7324
SECI Engineers & Buyers' Guide
Fax: (949)642-7327