PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
LCCC
CDIP
CDIP
CFP
CDIP
CDIP
TSSOP
SOIC
Package
Drawing
FK
J
J
W
J
J
PW
D
Pins Package
Qty
1
1
1
1
1
1
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
5962-89747012A
5962-8974701CA
5962-8974701VCA
5962-8974701VDA
JM38510/65751BCA
SN54HCT04J
SN74HCT04APWLE
SN74HCT04D
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
ACTIVE
20
14
14
14
14
14
14
14
None
None
None
None
None
None
None
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
None
Pb-Free
(RoHS)
Pb-Free
(RoHS)
None
None
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CU NIPDAU
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
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Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-NC-NC-NC
50
SN74HCT04DR
ACTIVE
SOIC
D
14
2500
CU NIPDAU
SN74HCT04DT
ACTIVE
SOIC
D
14
250
CU NIPDAU
SN74HCT04N
ACTIVE
PDIP
N
14
25
CU NIPDAU
SN74HCT04NSR
ACTIVE
SO
NS
14
2000
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-1-250C-UNLIM
SN74HCT04PW
ACTIVE
TSSOP
PW
14
90
CU NIPDAU
SN74HCT04PWLE
SN74HCT04PWR
OBSOLETE
ACTIVE
TSSOP
TSSOP
PW
PW
14
14
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CU NIPDAU
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Level-1-250C-UNLIM
2000
SN74HCT04PWT
ACTIVE
TSSOP
PW
14
250
CU NIPDAU
Level-1-250C-UNLIM
SNJ54HCT04FK
SNJ54HCT04J
ACTIVE
ACTIVE
LCCC
CDIP
FK
J
20
14
1
1
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Level-NC-NC-NC
Level-NC-NC-NC
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check
http://www.ti.com/productcontent
for the latest availability information and additional
product content details.
None:
Not yet available Lead (Pb-Free).
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:
The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
PACKAGE OPTION ADDENDUM
www.ti.com
28-Feb-2005
Addendum-Page 1