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參數(shù)資料
| 型號： | SNJ54LV374AJ |
| 廠商： | Texas Instruments, Inc. |
| 元件分類： | 通用總線功能 |
| 英文描述： | Small Signal Darlington NPN (lead free); Package: SOT-23 (TO-236) 3 LEAD; No of Pins: 3; Container: Tape and Reel; Qty per Container: 3000 |
| 中文描述： | 八路邊緣觸發(fā)的D型人字拖，3態(tài)輸出 |
| 文件頁數(shù)： | 8/17頁 |
| 文件大小： | 585K |
| 代理商： | SNJ54LV374AJ |
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
SSOP
Package
Drawing
DB
Pins Package
Qty
2000
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
SN74LV374ADBR
ACTIVE
20
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
None
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-1-250C-UNLIM
SN74LV374ADGVR
ACTIVE
TVSOP
DGV
20
2000
CU NIPDAU
SN74LV374ADW
ACTIVE
SOIC
DW
20
25
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Level-1-240C-UNLIM
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-1-250C-UNLIM
SN74LV374ADWR
ACTIVE
SOIC
DW
20
2000
CU NIPDAU
SN74LV374AGQNR
SN74LV374ANSR
ACTIVE
ACTIVE
VFBGA
SO
GQN
NS
20
20
1000
2000
SNPB
CU NIPDAU
SN74LV374APW
ACTIVE
TSSOP
PW
20
70
CU NIPDAU
SN74LV374APWR
ACTIVE
TSSOP
PW
20
2000
CU NIPDAU
Level-1-250C-UNLIM
SN74LV374APWT
ACTIVE
TSSOP
PW
20
250
CU NIPDAU
Level-1-250C-UNLIM
SN74LV374ARGYR
ACTIVE
QFN
RGY
20
1000 Green (RoHS &
no Sb/Br)
1000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1YEAR
SN74LV374AZQNR
ACTIVE
VFBGA
ZQN
20
SNAGCU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check
for the latest availability information and additionalproduct content details.
None:
Not yet available Lead (Pb-Free).
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:
The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
25-Feb-2005
Addendum-Page 1
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