
SCLS399J APRIL 1998 REVISED APRIL 2005
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
2-V to 5.5-V V
CC
Operation
Max t
pd
of 10.5 ns at 5 V
Typical V
OLP
(Output Ground Bounce)
<0.8 V at V
CC
= 3.3 V, T
A
= 25
°
C
Typical V
OHV
(Output V
OH
Undershoot)
>2.3 V at V
CC
= 3.3 V, T
A
= 25
°
C
I
off
Supports Partial-Power-Down Mode
Operation
Support Mixed-Mode Voltage Operation on
All Ports
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
2000-V Human-Body Model (A114-A)
200-V Machine Model (A115-A)
1000-V Charged-Device Model (C101)
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
CLR
1Q
1D
2D
2Q
3Q
3D
4D
4Q
GND
V
CC
8Q
8D
7D
7Q
6Q
6D
5D
5Q
CLK
SN54LV273A . . . J OR W PACKAGE
SN74LV273A . . . DB, DGV, DW, NS,
OR PW PACKAGE
(TOP VIEW)
3
2 1 20 19
9 10 11 12 13
4
5
6
7
8
18
17
16
15
14
8D
7D
7Q
6Q
6D
2D
2Q
3Q
3D
4D
1
1
C
5
5
8
4
G
C
V
C
SN54LV273A . . . FK PACKAGE
(TOP VIEW)
SN74LV273A . . . RGY PACKAGE
(TOP VIEW)
1
20
10
11
2
3
4
5
6
7
8
9
19
18
17
16
15
14
13
12
8Q
8D
7D
7Q
6Q
6D
5D
5Q
1Q
1D
2D
2Q
3Q
3D
4D
4Q
C
C
V
G
C
description/ordering information
The ’LV273A devices are octal D-type flip-flops designed for 2-V to 5.5-V V
CC
operation.
ORDERING INFORMATION
TA
PACKAGE
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
QFN RGY
Reel of 1000
SN74LV273ARGYR
LV273A
SOIC DW
Tube of 25
SN74LV273ADW
LV273A
Reel of 2000
SN74LV273ADWR
LV273A
SOP NS
Reel of 2000
SN74LV273ANSR
74LV273A
40 C to 85 C
SSOP DB
Reel of 2000
SN74LV273ADBR
LV273A
Tube of 70
SN74LV273APW
TSSOP PW
Reel of 2000
SN74LV273APWR
LV273A
Reel of 250
SN74LV273APWT
TVSOP DGV
Reel of 2000
SN74LV273ADGVR
LV273A
CDIP J
Tube of 20
SNJ54LV273AJ
SNJ54LV273AJ
55 C to 125 C
CFP W
Tube of 85
SNJ54LV273AW
SNJ54LV273AW
LCCC FK
Tube of 55
SNJ54LV273AFK
SNJ54LV273AFK
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
Copyright
2005, Texas Instruments Incorporated
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.