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參數(shù)資料
| 型號(hào)： | SNJ54LV221AJ |
| 廠商： | Texas Instruments, Inc. |
| 元件分類： | 通用總線功能 |
| 英文描述： | Small Signal NPN; Package: SOT-23 (TO-236) 3 LEAD; No of Pins: 3; Container: Tape and Reel; Qty per Container: 3000 |
| 中文描述： | 施密特觸發(fā)輸入與雙單穩(wěn)態(tài)多頻振蕩器 |
| 文件頁數(shù)： | 13/19頁 |
| 文件大小： | 436K |
| 代理商： | SNJ54LV221AJ |
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
SOIC
Package
Drawing
D
Pins Package
Qty
40
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
SN74LV221AD
ACTIVE
16
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-1-250C-UNLIM
SN74LV221ADBR
ACTIVE
SSOP
DB
16
2000
CU NIPDAU
SN74LV221ADGVR
ACTIVE
TVSOP
DGV
16
2000
CU NIPDAU
SN74LV221ADR
ACTIVE
SOIC
D
16
2500
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-1-250C-UNLIM
SN74LV221ANSR
ACTIVE
SO
NS
16
2000
CU NIPDAU
SN74LV221APW
ACTIVE
TSSOP
PW
16
90
CU NIPDAU
SN74LV221APWE4
ACTIVE
TSSOP
PW
16
90
CU NIPDAU
Level-1-250C-UNLIM
SN74LV221APWR
ACTIVE
TSSOP
PW
16
2000
CU NIPDAU
Level-1-250C-UNLIM
SN74LV221APWRE4
ACTIVE
TSSOP
PW
16
2000
CU NIPDAU
Level-1-250C-UNLIM
SN74LV221APWT
ACTIVE
TSSOP
PW
16
250
CU NIPDAU
Level-1-250C-UNLIM
SN74LV221APWTE4
ACTIVE
TSSOP
PW
16
250
CU NIPDAU
Level-1-250C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
for the latest availability information and additional product content details.Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Eco
Plan
-
The
planned
eco-friendly
classification:
Pb-Free
(RoHS)
or
Green
(RoHS
&
no
Sb/Br)
-
please
check
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:
The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
6-May-2005
Addendum-Page 1
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