
SCLS306C JANUARY 1996 REVISED AUGUST 2003
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
FUNCTION TABLE
(each buffer/driver)
INPUTS
OE2
OUTPUT
Y
OE1
A
L
L
L
L
L
L
H
H
H
X
X
Z
X
H
X
Z
logic diagram (positive logic)
OE1
OE2
To Seven Other Channels
A1
Y1
1
19
2
18
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
CC
Input clamp current, I
IK
(V
I
< 0 or V
I
> V
CC
) (see Note 1)
Output clamp current, I
OK
(V
O
< 0 or V
O
> V
CC
) (see Note 1)
Continuous output current, I
O
(V
O
= 0 to V
CC
)
Continuous current through V
CC
or GND
Package thermal impedance,
θ
JA
(see Note 2): DB package
0.5 V to 7 V
±
20 mA
±
20 mA
±
35 mA
±
70 mA
70
°
C/W
58
°
C/W
69
°
C/W
60
°
C/W
83
°
C/W
65
°
C to 150
°
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DW package
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NS package
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
stg
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES:
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.