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參數(shù)資料
| 型號： | SNJ54HCT257FK |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | Mounting Kit; Contents Of Kit:1 Thermalfilm Insulator, 1 Shoulder Washer, 1 #4 Flat Washer, 1 No. 4-40 UNC-2B Hex Nut, 1 No. 4-40 UNC-2A x 1/2 Long Phillips Pan Head Screw, 1 No. 4 Lockwasher; For Use With:TO-220 Packages RoHS Compliant: Yes |
| 中文描述： | 四2線1線數(shù)據(jù)選擇器/ 3態(tài)輸出多工器 |
| 文件頁數(shù)： | 1/8頁 |
| 文件大?。?/td> | 267K |
| 代理商： | SNJ54HCT257FK |
SCLS072D NOVEMBER 1988 REVISED SEPTEMBER 2003
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
Operating Voltage Range of 4.5 V to 5.5 V
High-Current 3-State Outputs Interface
Directly With System Bus
Typical t
pd
= 17 ns
Low Power Consumption, 80-
μ
A Max I
CC
±
6-mA Output Drive at 5 V
Low Input Current of 1
μ
A Max
Inputs Are TTL-Voltage Compatible
Provide Bus Interface From Multiple
Sources in High-Performance Systems
Buffered Inputs and Outputs
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
A/B
1A
1B
1Y
2A
2B
2Y
GND
V
CC
OE
4A
4B
4Y
3A
3B
3Y
SN54HCT257 . . . J PACKAGE
SN74HCT257 . . . D OR N PACKAGE
(TOP VIEW)
3
2 1 20 19
9 10 11 12 13
4
5
6
7
8
18
17
16
15
14
4A
4B
NC
4Y
3A
1B
1Y
NC
2A
2B
1
A
N
3
3
V
O
2
G
N
SN54HCT257 . . . FK PACKAGE
(TOP VIEW)
C
NC No internal connection
description/ordering information
The ’HCT257 devices are designed to multiplex signals from 4-bit data sources to 4-output data lines in
bus-organized systems. The 3-state outputs do not load the data lines when the output-enable (OE) input is at
the high logic level.
To ensure the high-impedance state during power up or power down, OE should be tied to V
CC
through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
TA
PACKAGE
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
PDIP N
Tube of 25
SN74HCT257N
SN74HCT257N
40
°
C to 85
°
C
Tube of 40
SN74HCT257D
SOIC D
Reel of 2500
SN74HCT257DR
HCT257
Reel of 250
SN74HCT257DT
55
°
C to 125
°
C
CDIP J
Tube of 25
SNJ54HCT257J
SNJ54HCT257J
LCCC FK
Tube of 55
SNJ54HCT257FK
SNJ54HCT257FK
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright
2003, Texas Instruments Incorporated
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