![](http://datasheet.mmic.net.cn/300000/SNJ54HCT244W_datasheet_16215777/SNJ54HCT244W_6.png)
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
CDIP
CFP
LCCC
CDIP
LCCC
CDIP
CDIP
SSOP
SSOP
Package
Drawing
J
W
FK
J
FK
J
J
DB
DB
Pins Package
Qty
1
1
1
1
1
1
1
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
5962-8513001VRA
5962-8513001VSA
85130012A
8513001RA
JM38510/65755B2A
JM38510/65755BRA
SN54HCT244J
SN74HCT244DBLE
SN74HCT244DBR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
ACTIVE
20
20
20
20
20
20
20
20
20
None
None
None
None
None
None
None
None
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
None
Pb-Free
(RoHS)
Pb-Free
(RoHS)
None
Pb-Free
(RoHS)
Pb-Free
(RoHS)
None
None
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CU NIPDAU
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
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Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Level-NC-NC-NC
2000
SN74HCT244DW
ACTIVE
SOIC
DW
20
25
CU NIPDAU
SN74HCT244DWR
ACTIVE
SOIC
DW
20
2000
CU NIPDAU
SN74HCT244N
ACTIVE
PDIP
N
20
20
CU NIPDAU
SN74HCT244N3
SN74HCT244NSR
OBSOLETE
ACTIVE
PDIP
SO
N
NS
20
20
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Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-1-250C-UNLIM
2000
SN74HCT244PW
ACTIVE
TSSOP
PW
20
70
CU NIPDAU
SN74HCT244PWLE
SN74HCT244PWR
OBSOLETE
ACTIVE
TSSOP
TSSOP
PW
PW
20
20
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CU NIPDAU
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Level-1-250C-UNLIM
2000
SN74HCT244PWT
ACTIVE
TSSOP
PW
20
250
CU NIPDAU
Level-1-250C-UNLIM
SNJ54HCT244FK
SNJ54HCT244J
ACTIVE
ACTIVE
LCCC
CDIP
FK
J
20
20
1
1
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Level-NC-NC-NC
Level-NC-NC-NC
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check
for the latest availability information and additionalproduct content details.
Not yet available Lead (Pb-Free).
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
The information provided on this page represents TI's knowledge and belief as of the date that it is