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參數(shù)資料
| 型號： | SNJ54ABT16825WD |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | 18-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS |
| 中文描述： | 18位緩沖器/ 3司機態(tài)輸出 |
| 文件頁數(shù)： | 6/10頁 |
| 文件大小： | 193K |
| 代理商： | SNJ54ABT16825WD |
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
SSOP
Package
Drawing
DL
Pins Package
Qty
20
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
SN74ABT16825DL
ACTIVE
56
Green (RoHS &
no Sb/Br)
Green (RoHS &
no Sb/Br)
1000 Green (RoHS &
no Sb/Br)
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT16825DLG4
ACTIVE
SSOP
DL
56
20
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT16825DLR
ACTIVE
SSOP
DL
56
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT16825DLRG4
ACTIVE
SSOP
DL
56
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:
The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
Addendum-Page 1
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