• 參數(shù)資料
    型號: SN75LVDS83BDGG
    廠商: Texas Instruments
    文件頁數(shù): 24/30頁
    文件大?。?/td> 0K
    描述: IC FLATLINK TRANSMITTER 56TSSOP
    標準包裝: 35
    系列: FlatLink™
    類型: 發(fā)射器
    驅(qū)動器/接收器數(shù): 5/0
    規(guī)程: LVDS
    電源電壓: 3 V ~ 3.6 V
    安裝類型: 表面貼裝
    封裝/外殼: 56-TFSOP(0.240",6.10mm 寬)
    供應(yīng)商設(shè)備封裝: 56-TSSOP
    包裝: 管件
    產(chǎn)品目錄頁面: 907 (CN2011-ZH PDF)
    其它名稱: 296-24552-5
    IMPORTANT NOTICE
    Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
    changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
    issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
    complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
    supplied at the time of order acknowledgment.
    TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
    and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
    to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
    performed.
    TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
    applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
    adequate design and operating safeguards.
    TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
    other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
    published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
    endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
    third party, or a license from TI under the patents or other intellectual property of TI.
    Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
    and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
    documentation. Information of third parties may be subject to additional restrictions.
    Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
    voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
    TI is not responsible or liable for any such statements.
    Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
    concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
    that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
    anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
    harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
    of any TI components in safety-critical applications.
    In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
    help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
    requirements. Nonetheless, such components are subject to these terms.
    No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
    have executed a special agreement specifically governing such use.
    Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
    military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
    which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
    regulatory requirements in connection with such use.
    TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
    non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
    Products
    Applications
    Audio
    Automotive and Transportation
    Amplifiers
    Communications and Telecom
    Data Converters
    Computers and Peripherals
    DLP Products
    Consumer Electronics
    DSP
    Energy and Lighting
    Clocks and Timers
    Industrial
    Interface
    Medical
    Logic
    Security
    Power Mgmt
    Space, Avionics and Defense
    Microcontrollers
    Video and Imaging
    RFID
    OMAP Applications Processors
    TI E2E Community
    Wireless Connectivity
    Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
    Copyright 2014, Texas Instruments Incorporated
    相關(guān)PDF資料
    PDF描述
    SOMDM3730-10-1782IFXR SYSTEM ON MODULE LV DM3730
    SOMOMAP3530-11-1672IFXR SYSTEM ON MODULE LV OMAP3530
    SOMOMAP3530-21-1670AGCR SYSTEM ON MODULE LV OMAP3530
    SOMOMAP3530-21-1780AGIR SYSTEM ON MODULE LV OMAP3530
    SP1485EMN-L IC TXRX RS485 DIFF ESD 8SOIC
    相關(guān)代理商/技術(shù)參數(shù)
    參數(shù)描述
    SN75LVDS83BDGG 制造商:Texas Instruments 功能描述:IC FLATLINK TRANSMITTER 3.6V TSSOP-56 制造商:Texas Instruments 功能描述:IC, FLATLINK TRANSMITTER, 3.6V, TSSOP-56
    SN75LVDS83BDGGR 功能描述:總線發(fā)射器 FlatLink 10-135MHz Transmitter RoHS:否 制造商:Texas Instruments 數(shù)據(jù)速率:135 Mpps 接口: 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:TSSOP-56 封裝:Reel
    SN75LVDS83BZQLR 功能描述:總線發(fā)射器 FlatLink 10-135MHz Transmitter RoHS:否 制造商:Texas Instruments 數(shù)據(jù)速率:135 Mpps 接口: 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:TSSOP-56 封裝:Reel
    SN75LVDS83CZQLR 功能描述:顯示接口集成電路 FlatLink 10-85MHz Transmitter RoHS:否 制造商:Texas Instruments 電源電流:125 mA 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:WQFN-60 封裝:Reel
    SN75LVDS83DGG 功能描述:總線發(fā)射器 Flatlink RoHS:否 制造商:Texas Instruments 數(shù)據(jù)速率:135 Mpps 接口: 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:TSSOP-56 封裝:Reel