參數(shù)資料
型號(hào): SN74LVC3GU04YZPR
廠商: TEXAS INSTRUMENTS INC
元件分類: 門電路
英文描述: LVC/LCX/Z SERIES, TRIPLE 1-INPUT INVERT GATE, BGA8
封裝: GREEN, DSBGA-8
文件頁數(shù): 1/13頁
文件大小: 519K
代理商: SN74LVC3GU04YZPR
www.ti.com
FEATURES
Seemechanicaldrawingsfordimensions.
DCTPACKAGE
(TOP VIEW)
DCUPACKAGE
(TOP VIEW)
YZP PACKAGE
(BOTTOMVIEW)
1
V
CC
8
1A
2
7
3Y
1Y
3
6
2A
3A
4
5
GND
2Y
3
6
3A
2A
8
1
V
CC
1A
5
GND
4
2Y
2
7
1Y
3Y
GND
5
4
2Y
3 6
3A
2A
2 7
1Y
3Y
8
V
CC
1
1A
DESCRIPTION/ORDERING INFORMATION
TRIPLE INVERTER GATE
SCES539C – JANUARY 2004 – REVISED FEBRUARY 2007
Available in the Texas Instruments
Typical V
OHV (Output VOH Undershoot)
NanoFree Package
>2 V at V
CC = 3.3 V, TA = 25°C
Supports 5-V V
CC Operation
Unbuffered Outputs
Inputs Accept Voltages to 5.5 V
Latch-Up Performance Exceeds 100 mA
Per JESD 78, Class II
Max t
pd of 3.9 ns at 3.3 V
ESD Protection Exceeds JESD 22
Low Power Consumption, 10-A Max I
CC
2000-V Human-Body Model (A114-A)
±24-mA Output Drive at 3.3 V
200-V Machine Model (A115-A)
Typical V
OLP (Output Ground Bounce)
<0.8 V at V
CC = 3.3 V, TA = 25°C
1000-V Charged-Device Model (C101)
This triple inverter is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC3GU04 contains three inverters with unbuffered outputs and performs the Boolean function Y = A.
NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(2)
NanoFree – WCSP (DSBGA)
Reel of 3000
SN74LVC3GU04YZPR
_ _ _CD_
0.23-mm Large Bump – YZP (Pb-free)
SSOP – DCT
Reel of 3000
SN74LVC3GU04DCTR
CU4_ _ _
–40°C to 85°C
Reel of 3000
SN74LVC3GU04DCUR
VSSOP – DCU
CU4_
Reel of 250
SN74LVC3GU04DCUT
(1)
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2)
DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,
= Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright 2004–2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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