參數(shù)資料
        型號(hào): SN74LVC3G14YEPR
        廠商: Texas Instruments, Inc.
        英文描述: TRIPLE SCHMITT TRIGGER INVERTER
        中文描述: 三重施密特觸發(fā)器逆變器
        文件頁(yè)數(shù): 1/12頁(yè)
        文件大?。?/td> 260K
        代理商: SN74LVC3G14YEPR
        SCES470A AUGUST 2003 REVISED AUGUST 2003
        1
        POST OFFICE BOX 655303
        DALLAS, TEXAS 75265
        Available in the Texas Instruments
        NanoStar
        and NanoFree
        Packages
        Supports 5-V V
        CC
        Operation
        Inputs Accept Voltages to 5.5 V
        Max t
        pd
        of 5.4 ns at 3.3 V
        Low Power Consumption, 10-
        μ
        A Max I
        CC
        ±
        24-mA Output Drive at 3.3 V
        Typical V
        OLP
        (Output Ground Bounce)
        <0.8 V at V
        CC
        = 3.3 V, T
        A
        = 25
        °
        C
        Typical V
        OHV
        (Output V
        OH
        Undershoot)
        >2 V at V
        CC
        = 3.3 V, T
        A
        = 25
        °
        C
        I
        off
        Supports Partial-Power-Down Mode
        Operation
        Latch-Up Performance Exceeds 100 mA Per
        JESD 78, Class II
        ESD Protection Exceeds JESD 22
        2000-V Human-Body Model (A114-A)
        200-V Machine Model (A115-A)
        1000-V Charged-Device Model (C101)
        description/ordering information
        This triple Schmitt-trigger buffer is designed for 1.65-V to 5.5-V V
        CC
        operation.
        The SN74LVC3G17 contains three buffers, and performs the Boolean function Y = A. The device functions as
        three independent buffers, but because of Schmitt action, it may have different input threshold levels for
        positive-going (V
        T+
        ) and negative-going (V
        T
        ) signals.
        This device is fully specified for partial-power-down applications using I
        off
        . The I
        off
        circuitry disables the outputs,
        preventing damaging current backflow through the device when it is powered down.
        NanoStar
        and NanoFree
        package technology is a major breakthrough in IC packaging concepts, using the
        die as the package.
        ORDERING INFORMATION
        TA
        PACKAGE
        ORDERABLE
        PART NUMBER
        TOP-SIDE
        MARKING
        NanoStar
        WCSP (DSBGA)
        0.23-mm Large Bump YEP
        Tape and reel
        SN74LVC3G17YEPR
        _ _ _C7_
        40
        °
        C to 85
        °
        C
        NanoFree
        WCSP (DSBGA)
        0.23-mm Large Bump YZP (Pb-free)
        SN74LVC3G17YZPR
        SSOP DCT
        Tape and reel
        SN74LVC3G17DCTR
        C17_ _ _
        VSSOP DCU
        Tape and reel
        SN74LVC3G17DCUR
        C17_
        Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
        www.ti.com/sc/package.
        DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
        DCU: The actual top-side marking has one additional character that designates the assembly/test site.
        YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
        following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
        (1 = SnPb,
        = Pb-free).
        Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
        Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
        Copyright
        2003, Texas Instruments Incorporated
        DCT OR DCU PACKAGE
        (TOP VIEW)
        1
        2
        3
        4
        8
        7
        6
        5
        1A
        3Y
        2A
        GND
        V
        CC
        1Y
        3A
        2Y
        4
        3
        2
        1
        5
        6
        7
        8
        GND
        2A
        3Y
        1A
        2Y
        3A
        1Y
        V
        CC
        YEP OR YZP PACKAGE
        (BOTTOM VIEW)
        NanoStar and NanoFree are trademarks of Texas Instruments.
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