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參數(shù)資料
| 型號(hào)： | SN74LVC3G07YEPR |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | TRIPLE BUFFER / DRIVER WITH OPEN DRAIN OUTPUTS |
| 中文描述： | 三重緩沖/有開路漏極輸出驅(qū)動(dòng) |
| 文件頁數(shù)： | 1/12頁 |
| 文件大?。?/td> | 260K |
| 代理商： | SN74LVC3G07YEPR |
SCES470A AUGUST 2003 REVISED AUGUST 2003
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
Available in the Texas Instruments
NanoStar
and NanoFree
Packages
Supports 5-V V
CC
Operation
Inputs Accept Voltages to 5.5 V
Max t
pd
of 5.4 ns at 3.3 V
Low Power Consumption, 10-
μ
A Max I
CC
±
24-mA Output Drive at 3.3 V
Typical V
OLP
(Output Ground Bounce)
<0.8 V at V
CC
= 3.3 V, T
A
= 25
°
C
Typical V
OHV
(Output V
OH
Undershoot)
>2 V at V
CC
= 3.3 V, T
A
= 25
°
C
I
off
Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
2000-V Human-Body Model (A114-A)
200-V Machine Model (A115-A)
1000-V Charged-Device Model (C101)
description/ordering information
This triple Schmitt-trigger buffer is designed for 1.65-V to 5.5-V V
CC
operation.
The SN74LVC3G17 contains three buffers, and performs the Boolean function Y = A. The device functions as
three independent buffers, but because of Schmitt action, it may have different input threshold levels for
positive-going (V
T+
) and negative-going (V
T
) signals.
This device is fully specified for partial-power-down applications using I
off
. The I
off
circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
NanoStar
and NanoFree
package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
ORDERING INFORMATION
TA
PACKAGE
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
NanoStar
WCSP (DSBGA)
0.23-mm Large Bump YEP
Tape and reel
SN74LVC3G17YEPR
_ _ _C7_
40
°
C to 85
°
C
NanoFree
WCSP (DSBGA)
0.23-mm Large Bump YZP (Pb-free)
SN74LVC3G17YZPR
SSOP DCT
Tape and reel
SN74LVC3G17DCTR
C17_ _ _
VSSOP DCU
Tape and reel
SN74LVC3G17DCUR
C17_
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb,
= Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright
2003, Texas Instruments Incorporated
DCT OR DCU PACKAGE
(TOP VIEW)
1
2
3
4
8
7
6
5
1A
3Y
2A
GND
V
CC
1Y
3A
2Y
4
3
2
1
5
6
7
8
GND
2A
3Y
1A
2Y
3A
1Y
V
CC
YEP OR YZP PACKAGE
(BOTTOM VIEW)
NanoStar and NanoFree are trademarks of Texas Instruments.
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| SN74LVC3G07YZPR | 功能描述:緩沖器和線路驅(qū)動(dòng)器 TripleBffr/Drvr w/OpenDrainOutput RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
| SN74LVC3G14DCTR | 功能描述:變換器 Triple Schmitt-Trgr RoHS:否 制造商:NXP Semiconductors 電路數(shù)量:6 邏輯系列:74ABT 邏輯類型:BiCMOS 高電平輸出電流:- 15 mA 低電平輸出電流:20 mA 傳播延遲時(shí)間:2.2 ns 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 工作溫度范圍: 封裝 / 箱體:DIP-14 封裝:Tube |
| SN74LVC3G14DCTR | 制造商:Texas Instruments 功能描述:LOGIC IC TRIPLE SCHMITT TRIGGER INVERTE |
| SN74LVC3G14DCTRE4 | 功能描述:變換器 Triple Schmitt-Trgr RoHS:否 制造商:NXP Semiconductors 電路數(shù)量:6 邏輯系列:74ABT 邏輯類型:BiCMOS 高電平輸出電流:- 15 mA 低電平輸出電流:20 mA 傳播延遲時(shí)間:2.2 ns 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 工作溫度范圍: 封裝 / 箱體:DIP-14 封裝:Tube |
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