參數(shù)資料
型號: SN74LVC2G07YEAR
廠商: TEXAS INSTRUMENTS INC
元件分類: 門電路
英文描述: LVC/LCX/Z SERIES, DUAL 1-INPUT NON-INVERT GATE, BGA6
封裝: MO-211EA, DSBGA-6
文件頁數(shù): 1/14頁
文件大?。?/td> 405K
代理商: SN74LVC2G07YEAR
www.ti.com
FEATURES
Seemechanicaldrawingsfordimensions.
DBVPACKAGE
(TOP VIEW)
DCKPACKAGE
(TOP VIEW)
YEA, YEP, YZA,
OR YZP PACKAGE
(BOTTOMVIEW)
2
GND
V
CC
5
3
4
2A
2Y
6
1
1A
1Y
3
4
2A
2
GND
2Y
5
1
1A
V
CC
6
1Y
2
GND
V
CC
1
5
1A
2A
4
3
2Y
6
1Y
DESCRIPTION/ORDERING INFORMATION
DUAL BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUTS
SCES308F – AUGUST 2001 – REVISED AUGUST 2006
Available in the Texas Instruments
Typical V
OHV (Output VOH Undershoot)
NanoStar and NanoFree Packages
>2 V at V
CC = 3.3 V, TA = 25°C
Supports 5-V V
CC Operation
I
off Supports Partial-Power-Down Mode
Operation
Inputs and Open-Drain Outputs Accept
Voltages up to 5.5 V
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
Max t
pd of 3.7 ns at 3.3 V
ESD Protection Exceeds JESD 22
Low Power Consumption, 10-
A Max I
CC
– 2000-V Human-Body Model (A114-A)
±24-mA Output Drive at 3.3 V
– 200-V Machine Model (A115-A)
Typical V
OLP (Output Ground Bounce)
<0.8 V at V
CC = 3.3 V, TA = 25°C
– 1000-V Charged-Device Model (C101)
This dual buffer/driver is designed for 1.65-V to 5.5-V VCC operation. The output of the SN74LVC2G07 is open
drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high
wired-AND functions. The maximum sink current is 32 mA.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(2)
NanoStar – WCSP (DSBGA)
SN74LVC2G07YEAR
0.17-mm Small Bump – YEA
NanoFree – WCSP (DSBGA)
SN74LVC2G07YZAR
0.17-mm Small Bump – YZA (Pb-free)
Reel of 3000
_ _ _CV_
NanoStar – WCSP (DSBGA)
SN74LVC2G07YEPR
0.23-mm Large Bump – YEP
–40
°C to 85°C
NanoFree – WCSP (DSBGA)
SN74LVC2G07YZPR
0.23-mm Large Bump – YZP (Pb-free)
SOT (SOT-23) – DBV
Reel of 3000
SN74LVC2G07DBVR
C07_
Reel of 3000
SN74LVC2G07DCKR
SOT (SC-70) – DCK
CV_
Reel of 250
SN74LVC2G07DCKT
(1)
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2)
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA,YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,
= Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright 2001–2006, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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