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    參數(shù)資料
    型號: SN74LVC1G58YZAR
    廠商: Texas Instruments, Inc.
    英文描述: CONFIGURABLE MULTIPLE-FUNCTION GATE
    中文描述: 可配置的多功能的門
    文件頁數(shù): 1/16頁
    文件大?。?/td> 408K
    代理商: SN74LVC1G58YZAR
    www.ti.com
    FEATURES
    Available in the Texas Instruments
    NanoStar and NanoFree Packages
    Supports 5-V V
    CC
    Operation
    Inputs Accept Voltages to 5.5 V
    Max t
    pd
    of 6.3 ns at 3.3 V
    Low Power Consumption, 10-
    μ
    A Max I
    CC
    ±24-mA Output Drive at 3.3 V
    In2
    3
    2
    4
    6
    1
    In1
    In2
    Y
    GND
    In0
    DBV PACKAGE
    (TOP VIEW)
    YEA, YEP, YZA,
    OR YZP PACKAGE
    (BOTTOM VIEW)
    DCK PACKAGE
    (TOP VIEW)
    3
    2
    4
    6
    1
    In1
    In2
    Y
    GND
    In0
    3
    2
    4
    6
    1
    In1
    Y
    GND
    In0
    In1
    In0
    In2
    Y
    V
    CC
    GND
    DRL PACKAGE
    (TOP VIEW)
    See mechanical drawings for dimensions.
    1
    4
    2
    3
    6
    V
    CC
    V
    CC
    V
    CC
    5
    5
    5
    5
    DESCRIPTION/ORDERING INFORMATION
    This configurable multiple-function gate is designed for 1.65-V to 5.5-V V
    CC
    operation.
    The SN74LVC1G98 features configurable multiple functions. The output state is determined by eight patterns of
    3-bit input. The user can choose the logic functions MUX, AND, OR, NAND, NOR, inverter, and noninverter. All
    inputs can be connected to V
    CC
    or GND.
    SN74LVC1G98
    CONFIGURABLE MULTIPLE-FUNCTION GATE
    SCES417H–DECEMBER 2002–REVISED JUNE 2005
    I
    off
    Supports Partial-Power-Down Mode
    Operation
    Latch-Up Performance Exceeds 100 mA Per
    JESD 78, Class II
    ESD Protection Exceeds JESD 22
    – 2000-V Human-Body Model (A114-A)
    – 200-V Machine Model (A115-A)
    – 1000-V Charged-Device Model (C101)
    ORDERING INFORMATION
    T
    A
    PACKAGE
    (1)
    ORDERABLE PART NUMBER
    TOP-SIDE MARKING
    (2)
    NanoStar – WCSP (DSBGA)
    0.17-mm Small Bump – YEA
    NanoFree – WCSP (DSBGA)
    0.17-mm Small Bump – YZA (Pb-free)
    NanoStar – WCSP (DSBGA)
    0.23-mm Large Bump – YEP
    NanoFree – WCSP (DSBGA)
    0.23-mm Large Bump – YZP (Pb-free)
    SN74LVC1G98YEAR
    SN74LVC1G98YZAR
    Reel of 3000
    _ _ _CW_
    SN74LVC1G98YEPR
    –40°C to 85°C
    SN74LVC1G98YZPR
    Reel of 3000
    Reel of 250
    Reel of 3000
    Reel of 250
    Reel of 4000
    SN74LVC1G98DBVR
    SN74LVC1G98DBVT
    SN74LVC1G98DCKR
    SN74LVC1G98DCKT
    SN74LVC1G98DRLR
    SOT (SOT-23) – DBV
    C98_
    SOT (SC-70) – DCK
    CW_
    SOT (SOT-553) – DRL
    CW_
    (1)
    Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
    www.ti.com/sc/package.
    DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.
    YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
    following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,
    = Pb-free).
    (2)
    Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
    Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
    NanoStar, NanoFree are trademarks of Texas Instruments.
    PRODUCTION DATA information is current as of publication date.
    Products conform to specifications per the terms of the Texas
    Instruments standard warranty. Production processing does not
    necessarily include testing of all parameters.
    Copyright 2002–2005, Texas Instruments Incorporated
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