參數(shù)資料
型號(hào): SN74LV4066ARGYR
廠商: Texas Instruments
文件頁(yè)數(shù): 5/28頁(yè)
文件大?。?/td> 0K
描述: IC SWITCH QUAD 1X1 14QFN
標(biāo)準(zhǔn)包裝: 1
系列: 74LV
功能: 開(kāi)關(guān)
電路: 4 x SPST - NO
導(dǎo)通狀態(tài)電阻: 75 歐姆
電壓電源: 單電源
電壓 - 電源,單路/雙路(±): 2 V ~ 5.5 V
電流 - 電源: 20µA
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 14-VFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝: 14-VQFN 裸露焊盤(3.5x3.5)
包裝: 標(biāo)準(zhǔn)包裝
產(chǎn)品目錄頁(yè)面: 981 (CN2011-ZH PDF)
其它名稱: 296-13948-6
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Addendum-Page 2
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
Op Temp (°C)
Top-Side Markings
(4)
Samples
SN74LV4066APWE4
ACTIVE
TSSOP
PW
14
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
LW066A
SN74LV4066APWG4
ACTIVE
TSSOP
PW
14
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
LW066A
SN74LV4066APWR
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
LW066A
SN74LV4066APWRE4
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
LW066A
SN74LV4066APWRG4
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
LW066A
SN74LV4066APWT
ACTIVE
TSSOP
PW
14
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
LW066A
SN74LV4066APWTE4
ACTIVE
TSSOP
PW
14
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
LW066A
SN74LV4066APWTG4
ACTIVE
TSSOP
PW
14
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
LW066A
SN74LV4066ARGYR
ACTIVE
VQFN
RGY
14
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
LW066A
SN74LV4066ARGYRG4
ACTIVE
VQFN
RGY
14
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
LW066A
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
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