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參數(shù)資料
| 型號： | SN74CB3T3384DGVR |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | Hex Schmitt Inverter, Pb-free; Package: TSSOP-14; No of Pins: 14; Container: Tape and Reel; Qty per Container: 2500 |
| 中文描述： | 10位FET總線開關(guān)2.5V/3.3V的低電壓總線開關(guān)5 V容限電平轉(zhuǎn)換器 |
| 文件頁數(shù)： | 1/15頁 |
| 文件大小： | 345K |
| 代理商： | SN74CB3T3384DGVR |
SCDS159B OCTOBER 2003 REVISED MARCH 2004
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
Output Voltage Translation Tracks V
CC
Supports Mixed-Mode Signal Operation On
All Data I/O Ports
5-V Input Down To 3.3-V Output Level
Shift With 3.3-V V
CC
5-V/3.3-V Input Down To 2.5-V Output
Level Shift With 2.5-V V
CC
5-V-Tolerant I/Os With Device Powered-Up
or Powered-Down
Bidirectional Data Flow, With Near-Zero
Propagation Delay
Low ON-State Resistance (r
on
)
Characteristics (r
on
= 5
Typical)
Low Input/Output Capacitance Minimizes
Loading (C
io(OFF)
= 5 pF Typical)
Data and Control Inputs Provide
Undershoot Clamp Diodes
Low Power Consumption
(I
CC
= 40
μ
A Max)
V
CC
Operating Range From 2.3 V to 3.6 V
Data I/Os Support 0 to 5-V Signaling Levels
(For Example: 0.8-V, 1.2-V, 1.5-V, 1.8-V,
2.5-V, 3.3-V, 5-V)
Control Inputs Can Be Driven by TTL or
5-V/3.3-V/2.5-V CMOS Outputs
I
off
Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Performance Tested Per JESD 22
2000-V Human-Body Model
(A114-B, Class II)
1000-V Charged-Device Model (C101)
Supports Digital Applications: Level
Translation, Memory Interleaving, Bus
Isolation
Ideal for Low-Power Portable Equipment
DBQ, DGV, DW, OR PW PACKAGE
(TOP VIEW)
1OE
1B1
1A1
1A2
1B2
1B3
1A3
1A4
1B4
1B5
1A5
GND
V
CC
2B5
2A5
2A4
2B4
2B3
2A3
2A2
2B2
2B1
2A1
2OE
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
description/ordering information
ORDERING INFORMATION
TA
PACKAGE
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
SOIC DW
Tube
SN74CB3T3384DW
CB3T3384
Tape and reel
SN74CB3T3384DWR
40
°
C to 85
°
C
SSOP (QSOP) DBQ
Tape and reel
SN74CB3T3384DBQR
CB3T3384
TSSOP PW
Tube
SN74CB3T3384PW
KS384
Tape and reel
Tape and reel
SN74CB3T3384PWR
SN74CB3T3384DGVR
TVSOP DGV
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Copyright
2004, Texas Instruments Incorporated
!"#$%&'#! ( )*$$+!' &( #" ,*-.)&'#! /&'+
$#/*)'( )#!"#$% '# (,+)")&'#!( ,+$ '0+ '+$%( #" +1&( !('$*%+!'(
('&!/&$/2&$$&!'3 $#/*)'#! ,$#)+((!4 /#+( !#' !+)+((&$.3 !).*/+
'+('!4 #" &.. ,&$&%+'+$(
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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