參數(shù)資料
型號: SN74AVC1T45YEPR
廠商: TEXAS INSTRUMENTS INC
元件分類: 總線收發(fā)器
英文描述: AVC SERIES, 1-BIT TRANSCEIVER, TRUE OUTPUT, PBGA6
封裝: DSBGA-6
文件頁數(shù): 1/21頁
文件大?。?/td> 494K
代理商: SN74AVC1T45YEPR
www.ti.com
FEATURES
3
2
4
6
1
VCCA
VCCB
B
GND
A
DBV PACKAGE
(TOP VIEW)
DCK PACKAGE
(TOP VIEW)
3
2
4
6
1
VCCA
VCCB
B
GND
A
3
2
4
6
1
VCCA
VCCB
B
GND
A
DRL PACKAGE
(TOP VIEW)
See mechanical drawings for dimensions.
DIR
5
YEP OR YZP PACKAGE
(BOTTOM VIEW)
C1
B1
A1
C2
B2
A2
B
DIR
VCCB
A
GND
VCCA
3
2
1
4
5
6
DESCRIPTION/ORDERING INFORMATION
SINGLE-BIT DUAL-SUPPLY BUS TRANSCEIVER
WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTS
SCES530E – DECEMBER 2003 – REVISED JUNE 2006
Available in the Texas Instruments
Max Data Rates
NanoStar and NanoFree Packages
– 500 Mbps (1.8-V to 3.3-V Translation)
Fully Configurable Dual-Rail Design Allows
– 320 Mbps (<1.8-V to 3.3-V Translation)
Each Port to Operate Over the Full 1.2-V to
– 320 Mbps (Translate to 2.5 V or 1.8 V)
3.6-V Power-Supply Range
– 280 Mbps (Translate to 1.5 V)
V
CC Isolation Feature - If Either VCC Input Is at
– 240 Mbps (Translate to 1.2 V)
GND, Both Ports Are in the High-Impedance
Latch-Up Performance Exceeds 100 mA Per
State
JESD 78, Class II
DIR Input Circuit Referenced to V
CCA
ESD Protection Exceeds JESD 22
±12-mA Output Drive at 3.3 V
– 2000-V Human-Body Model (A114-A)
I/Os Are 4.6-V Tolerant
– 200-V Machine Model (A115-A)
I
off Supports Partial-Power-Down Mode
– 1000-V Charged-Device Model (C101)
Operation
This single-bit noninverting bus transceiver uses two separate configurable power-supply rails. The
SN74AVC1T45 is optimized to operate with VCCA/VCCB set at 1.4 V to 3.6 V. It is operational with VCCA/VCCB as
low as 1.2 V. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The
B port is designed to track VCCB. VCCB accepts any supply voltage from 1.2 V to 3.6 V. This allows for universal
low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, and 3.3-V voltage nodes.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(2)
NanoStar – WCSP (DSBGA)
SN74AVC1T45YEPR
0.23-mm Large Bump – YEP
Tape and reel
_ _ _TC_
NanoFree – WCSP (DSBGA)
SN74AVC1T45YZPR
0.23-mm Large Bump – YZP (Pb-free)
–40
°C to 85°C
SOT (SOT-23) – DBV
Tape and reel
SN74AVC1T45DBVR
DT1_
SOT (SC-70) – DCK
Tape and reel
SN74AVC1T45DCKR
TC_
SOT (SOT-553) – DRL
Reel of 4000
SN74AVC1T45DRLR
TC_
(1)
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2)
DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,
= Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright 2003–2006, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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