參數(shù)資料
型號: SN74AUP1G99YEPR
廠商: TEXAS INSTRUMENTS INC
元件分類: 標(biāo)準(zhǔn)邏輯
英文描述: SPECIALTY LOGIC CIRCUIT, PBGA8
封裝: DSBGA-8
文件頁數(shù): 12/24頁
文件大?。?/td> 413K
代理商: SN74AUP1G99YEPR
www.ti.com
DESCRIPTION/ORDERING INFORMATION
SN74AUP1G99
LOW-POWER ULTRA-CONFIGURABLE MULTIPLE-FUNCTION GATE
WITH 3-STATE OUTPUTS
SCES594B – JULY 2004 – REVISED AUGUST 2005
The SN74AUP1G99 features configurable multiple functions with a 3-state output. This device has the
input-disable feature, which allows floating input signals. The inputs and output are disabled when the
output-enable (OE) input is high. When OE is low, the output state is determined by 16 patterns of 4-bit input.
The user can choose the logic functions, such as MUX, AND, OR, NAND, NOR, XOR, XNOR, inverter, and
buffer. All inputs can be connected to VCC or GND.
This device functions as an independent gate with Schmitt-trigger inputs, which allows for slow input transition
and better switching noise immunity at the input.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
NanoStar and NanoFree package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(2)
NanoStar – WCSP (DSBGA)
Tape and reel
SN74AUP1G99YEPR
0.23-mm Large Bump – YEP
_ _ HY_
NanoFree – WCSP (DSBGA)
0.23-mm Large Bump – YZP
Tape and reel
SN74AUP1G99YZPR
–40
°C to 85°C
(Pb-free)
SSOP – DCT
Tape and reel
SN74AUP1G99DCTR
H99_ _ _
VSSOP – DCU
Tape and reel
SN74AUP1G99DCUR
H99_
(1)
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2)
DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,
= Pb-free).
2
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SN74AUP1G99YZPR 功能描述:邏輯門 LoPwr Ultra Conf MultFunctionGt RoHS:否 制造商:Texas Instruments 產(chǎn)品:OR 邏輯系列:LVC 柵極數(shù)量:2 線路數(shù)量(輸入/輸出):2 / 1 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 傳播延遲時間:3.8 ns 電源電壓-最大:5.5 V 電源電壓-最小:1.65 V 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DCU-8 封裝:Reel
SN74AUP1GO4DCKRE4 制造商:MAJOR 功能描述:
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SN74AUP1T04DCKR 功能描述:轉(zhuǎn)換 - 電壓電平 Low Pwr,1.8/2.5/3.3 Vin,3.3V CMOS Out RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8