參數(shù)資料
型號: SN74AUP1G58YZTR
廠商: TEXAS INSTRUMENTS INC
元件分類: 標準邏輯
英文描述: SPECIALTY LOGIC CIRCUIT, BGA6
封裝: GREEN, DSBGA-6
文件頁數(shù): 12/20頁
文件大?。?/td> 671K
代理商: SN74AUP1G58YZTR
www.ti.com
DESCRIPTION/ORDERING INFORMATION
3
1
6
In2
In1
In0
4
Y
LOW-POWER CONFIGURABLE MULTIPLE-FUNCTION GATE
SCES504H – NOVEMBER 2003 – REVISED DECEMBER 2007
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
TA
PACKAGE(1)(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(3)
NanoFree – WCSP (DSBGA)
Reel of 3000
SN74AUP1G58YFPR
PREVIEW
0.23-mm Large Bump – YFP (Pb-free)
NanoFree – WCSP (DSBGA)
Reel of 3000
SN74AUP1G58YZPR
_ _ _HJ_
0.23-mm Large Bump – YZP (Pb-free)
NanoFree – WCSP (DSBGA)
Reel of 3000
SN74AUP1G58YZTR
_ _ _HJ_
–40
°C to 85°C
0.23-mm Large Bump – YZT (Pb-free)
SON – DRY
Reel of 5000
SN74AUP1G58DRYR
PREVIEW
SOT (SOT-23) – DBV
Reel of 3000
SN74AUP1G58DBVR
H58_
SOT (SC-70) – DCK
Reel of 3000
SN74AUP1G58DCKR
HJ_
SOT (SOT-553) – DRL
Reel of 4000
SN74AUP1G58DRLR
(1)
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(3)
DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the assembly/test site.
YFP/YZP/YZT: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).
FUNCTION TABLE
INPUTS
OUTPUT
Y
In2
In1
In0
L
H
L
H
L
H
L
H
L
H
L
H
L
LOGIC DIAGRAM (POSITIVE LOGIC)
2
Copyright 2003–2007, Texas Instruments Incorporated
Product Folder Link(s): SN74AUP1G58
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