參數(shù)資料
型號: SN74AUC1G66YZAR
廠商: Texas Instruments, Inc.
英文描述: Analog Multiplexer/ Demultiplexer; Package: SOIC 16 LEAD; No of Pins: 16; Container: Rail; Qty per Container: 48
中文描述: 單雙邊模擬開關(guān)
文件頁數(shù): 2/13頁
文件大小: 325K
代理商: SN74AUC1G66YZAR
SCES377I SEPTEMBER 2001 REVISED NOVEMBER 2003
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
description/ordering information (continued)
This device is fully specified for partial-power-down applications using I
off
. The I
off
circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
For more information about AUC Little Logic devices, please refer to the TI application report,
Applications of
Texas Instruments AUC Sub-1-V Little Logic Devices,
literature number SCEA027.
FUNCTION TABLE
INPUTS
OUTPUT
Y
A
H
B
X
H
X
H
H
L
L
L
logic diagram (positive logic)
1
2
4
A
B
Y
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
CC
Input voltage range, V
I
(see Note 1)
Voltage range applied to any output in the high-impedance or power-off state, V
O
(see Note 1)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage range, V
O
(see Note 1)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, I
IK
(V
I
< 0)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, I
OK
(V
O
< 0)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, I
O
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through V
CC
or GND
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance,
θ
JA
(see Note 2): DBV package
DCK package
YEA/YZA package
YEP/YZP package
Storage temperature range, T
stg
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES:
1. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
0.5 V to 3.6 V
0.5 V to 3.6 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
0.5 V to 3.6 V
0.5 V to V
CC
+ 0.5 V
50 mA
50 mA
±
20 mA
±
100 mA
206
°
C/W
252
°
C/W
154
°
C/W
132
°
C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . .
65
°
C to 150
°
C
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