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參數(shù)資料
| 型號(hào)： | SN74AUC1G32YZAR |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | SINGLE 2-INPUT POSITIVE-OR GATE |
| 中文描述： | 單2輸入的正或門 |
| 文件頁數(shù)： | 1/13頁 |
| 文件大?。?/td> | 325K |
| 代理商： | SN74AUC1G32YZAR |
SCES377I SEPTEMBER 2001 REVISED NOVEMBER 2003
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
Available in the Texas Instruments
NanoStar
and NanoFree
Packages
Optimized for 1.8-V Operation and Is 3.6-V
I/O Tolerant to Support Mixed-Mode Signal
Operation
I
off
Supports Partial-Power-Down Mode
Operation
Sub 1-V Operable
Max t
pd
of 2.4 ns at 1.8 V
Low Power Consumption, 10-
μ
A Max I
CC
±
8-mA Output Drive at 1.8 V
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
2000-V Human-Body Model (A114-A)
200-V Machine Model (A115-A)
1000-V Charged-Device Model (C101)
description/ordering information
This single 2-input positive-OR gate is operational at 0.8-V to 2.7-V V
CC
, but is designed specifically for 1.65-V
to 1.95-V V
CC
operation.
The SN74AUC1G32 performs the Boolean function Y
A
B or Y
A
B in positive logic.
NanoStar
and NanoFree
package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
ORDERING INFORMATION
TA
PACKAGE
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
NanoStar
WCSP (DSBGA)
0.17-mm Small Bump YEA
SN74AUC1G32YEAR
NanoFree
WCSP (DSBGA)
0.17-mm Small Bump YZA (Pb-free)
Tape and reel
SN74AUC1G32YZAR
_ _ _UG_
40
°
C to 85
°
C
NanoStar
WCSP (DSBGA)
0.23-mm Large Bump YEP
SN74AUC1G32YEPR
NanoFree
WCSP (DSBGA)
0.23-mm Large Bump YZP (Pb-free)
SN74AUC1G32YZPR
SOT (SOT-23) DBV
Tape and reel
SN74AUC1G32DBVR
U32_
SOT (SC-70) DCK
Tape and reel
SN74AUC1G32DCKR
UG_
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,
and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb,
= Pb-free).
Copyright
2003, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar and NanoFree are trademarks of Texas Instruments.
DBV OR DCK PACKAGE
(TOP VIEW)
1
2
3
5
4
A
B
GND
V
CC
Y
3
2
1
4
5
GND
B
A
Y
V
CC
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SN74AUC1G32YZPR | 功能描述:邏輯門 Sngl2Inpt+ORGt RoHS:否 制造商:Texas Instruments 產(chǎn)品:OR 邏輯系列:LVC 柵極數(shù)量:2 線路數(shù)量（輸入/輸出）:2 / 1 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 傳播延遲時(shí)間:3.8 ns 電源電壓-最大:5.5 V 電源電壓-最小:1.65 V 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DCU-8 封裝:Reel |
| SN74AUC1G66DBVR | 功能描述:模擬開關(guān) IC Sngl Bilateral Analog Sw RoHS:否 制造商:Texas Instruments 開關(guān)數(shù)量:2 開關(guān)配置:SPDT 開啟電阻（最大值）:0.1 Ohms 切換電壓（最大）: 開啟時(shí)間（最大值）: 關(guān)閉時(shí)間（最大值）: 工作電源電壓:2.7 V to 4.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-16 |
| SN74AUC1G66DBVRE4 | 功能描述:模擬開關(guān) IC SNGL Bilateral Analog SWCH RoHS:否 制造商:Texas Instruments 開關(guān)數(shù)量:2 開關(guān)配置:SPDT 開啟電阻（最大值）:0.1 Ohms 切換電壓（最大）: 開啟時(shí)間（最大值）: 關(guān)閉時(shí)間（最大值）: 工作電源電壓:2.7 V to 4.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-16 |
| SN74AUC1G66DBVRG4 | 功能描述:模擬開關(guān) IC SNGL Bilateral Analog SWCH RoHS:否 制造商:Texas Instruments 開關(guān)數(shù)量:2 開關(guān)配置:SPDT 開啟電阻（最大值）:0.1 Ohms 切換電壓（最大）: 開啟時(shí)間（最大值）: 關(guān)閉時(shí)間（最大值）: 工作電源電壓:2.7 V to 4.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-16 |
| SN74AUC1G66DCKR | 功能描述:模擬開關(guān) IC Single Bilateral Analog Switch RoHS:否 制造商:Texas Instruments 開關(guān)數(shù)量:2 開關(guān)配置:SPDT 開啟電阻（最大值）:0.1 Ohms 切換電壓（最大）: 開啟時(shí)間（最大值）: 關(guān)閉時(shí)間（最大值）: 工作電源電壓:2.7 V to 4.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-16 |
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