參數(shù)資料
型號(hào): SN74AUC1G126DRYR
廠商: TEXAS INSTRUMENTS INC
元件分類: 總線收發(fā)器
英文描述: AUC SERIES, 1-BIT DRIVER, TRUE OUTPUT, DSO6
封裝: SON-6
文件頁(yè)數(shù): 1/13頁(yè)
文件大?。?/td> 590K
代理商: SN74AUC1G126DRYR
www.ti.com
FEATURES
DBVPACKAGE
(TOP VIEW)
3
2
4
5
1
OE
V
CC
Y
A
GND
Seemechanicaldrawingsfordimensions.
NC
Nointernalconnection
V
CC
3
2
4
5
1
OE
Y
A
GND
DCKPACKAGE
(TOP VIEW)
V
CC
OE
GND
Y
A
1
4
2
3
5
YZP PACKAGE
(BOTTOMVIEW)
DRY PACKAGE
(TOP VIEW)
A
OE
6
4
2
3
GND
Y
V
CC
1
5
NC
PR
EVIE
W
DESCRIPTION/ORDERING INFORMATION
SINGLE BUS BUFFER GATE
WITH 3-STATE OUTPUT
SCES383J – MARCH 2002 – REVISED JULY 2007
Available in the Texas Instruments
Low Power Consumption, 10-μA Max I
CC
NanoFree Package
±8-mA Output Drive at 1.8 V
Optimized for 1.8-V Operation and Is 3.6-V I/O
Latch-Up Performance Exceeds 100 mA Per
Tolerant to Support Mixed-Mode Signal
JESD 78, Class II
Operation
ESD Protection Exceeds JESD 22
I
off Supports Partial-Power-Down Mode
2000-V Human-Body Model (A114-A)
Operation
200-V Machine Model (A115-A)
Sub-1-V Operable
1000-V Charged-Device Model (C101)
Max t
pd of 2.5 ns at 1.8 V
This bus buffer gate is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC
operation.
The SN74AUC1G126 is a single line driver with a 3-state output. The output is disabled when the output-enable
(OE) input is low.
To ensure the high-impedance state during power up or power down, OE should be tied to GND through a
pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the
driver.
NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
TA
PACKAGE(1)(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(3)
NanoFree
Reel of 3000
SN74AUC1G126YZPR
_ _ _UN_
WCSP (DSBGA) – YZP (Pb-free)
SON – DRY
Reel of 5000
SN74AUC1G126DRYR
PREVIEW
–40
°C to 85°C
SOT (SOT-23) – DBV
Reel of 3000
SN74AUC1G126DBVR
U26_
SOT (SC-70) – DCK
Reel of 3000
SN74AUC1G126DCKR
UN_
(1)
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(3)
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
UNLESS
OTHERWISE
NOTED
this
document
contains
Copyright 2002–2007, Texas Instruments Incorporated
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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