
SN74ACT16374Q-EP
16-BIT D-TYPE EDGE-TRIGGERED FLIP-FLOP
WITH 3-STATE OUTPUTS
SCAS679B – MAY 2002 – REVISED JULY 2002
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
Controlled Baseline
– One Assembly/Test Site, One Fabrication
Site
Extended Temperature Performance of
–40
°
C to 125
°
C
Enhanced Diminishing Manufacturing
Sources (DMS) Support
Enhanced Product Change Notification
Qualification Pedigree
Member of the Texas Instruments
Widebus
Family
Inputs Are TTL-Voltage Compatible
3-State Bus Driving True Outputs
Flow-Through Architecture Optimizes
PCB Layout
Distributed V
CC
and GND Pins Minimize
High-Speed Switching Noise
Component qualification in accordance with JEDEC and industry
standards to ensure reliable operation over an extended
temperature range. This includes, but is not limited to, highly
accelerated stress test (HAST) or biased 85/85, temperature
cycle, autoclave or unbiased HAST, electromigration, bond
intermetallic life, and mold compound life.
description
The
edge-triggered D-type flip-flop with 3-state
outputs, designed specifically for driving highly
capacitive or relatively low-impedance loads. It is
particularly suitable for implementing buffer
registers, I/O ports, bidirectional bus drivers, and
working registers.
SN74ACT16374Q-EP
is
a
16-bit
This device can be used as two 8-bit flip-flops or one 16-bit flip-flop. On the positive transition of the clock (CLK)
input, the Q outputs of the flip-flop take on the logic levels set up at the data (D) inputs.
An output-enable (OE) input can be used to place the outputs in either a normal logic state (high or low logic
levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines
significantly. The high-impedance state provides the capability to drive bus lines in a bus-organized system,
without need for interface or pullup components. OE does not affect the internal operations of the flip-flop. Old
data can be retained or new data can be entered while the outputs are in the high-impedance state.
ORDERING INFORMATION
TA
PACKAGE
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
–40
°
C to 125
°
C
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
SSOP – DL
Tape and reel
SN74ACT16374QDLREP
ACT16374QEP
Copyright
2002, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments.
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1OE
1Q1
1Q2
GND
1Q3
1Q4
V
CC
1Q5
1Q6
GND
1Q7
1Q8
2Q1
2Q2
GND
2Q3
2Q4
V
CC
2Q5
2Q6
GND
2Q7
2Q8
2OE
1CLK
1D1
1D2
GND
1D3
1D4
V
CC
1D5
1D6
GND
1D7
1D8
2D1
2D2
GND
2D3
2D4
V
CC
2D5
2D6
GND
2D7
2D8
2CLK
DL PACKAGE
(TOP VIEW)