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參數(shù)資料
| 型號： | SN54LVTH16374WD |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | Analog Multiplexers/Demultiplexers with Injection Current Effect Control; Package: SOIC 16 LEAD; No of Pins: 16; Container: Rail; Qty per Container: 48 |
| 中文描述： | 的3.3V ABT生根粉16位邊沿觸發(fā)的D型倒裝3觸發(fā)器態(tài)輸出 |
| 文件頁數(shù)： | 9/17頁 |
| 文件大?。?/td> | 475K |
| 代理商： | SN54LVTH16374WD |
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
CFP
TSSOP
Package
Drawing
WD
DGG
Pins Package
Qty
1
2000 Green (RoHS &
no Sb/Br)
1000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
25
Green (RoHS &
no Sb/Br)
25
Green (RoHS &
no Sb/Br)
1000 Green (RoHS &
no Sb/Br)
1000
1000
1000 Green (RoHS &
no Sb/Br)
1000 Green (RoHS &
no Sb/Br)
1
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
5962-9564701QXA
74LVTH16374DGGRG4
ACTIVE
ACTIVE
48
48
TBD
Call TI
CU NIPDAU
Level-NC-NC-NC
Level-1-260C-UNLIM
74LVTH16374DLRG4
ACTIVE
SSOP
DL
48
CU NIPDAU
Level-1-260C-UNLIM
SN74LVTH16374DGGR
ACTIVE
TSSOP
DGG
48
CU NIPDAU
Level-1-260C-UNLIM
SN74LVTH16374DL
ACTIVE
SSOP
DL
48
CU NIPDAU
Level-1-260C-UNLIM
SN74LVTH16374DLG4
ACTIVE
SSOP
DL
48
CU NIPDAU
Level-1-260C-UNLIM
SN74LVTH16374DLR
ACTIVE
SSOP
DL
48
CU NIPDAU
Level-1-260C-UNLIM
SN74LVTH16374GQLR
SN74LVTH16374GRDR
SN74LVTH16374ZQLR
ACTIVE
ACTIVE
ACTIVE
VFBGA
LFBGA
VFBGA
GQL
GRD
ZQL
56
54
56
TBD
TBD
SNPB
SNPB
SNAGCU
Level-1-240C-UNLIM
Level-1-240C-UNLIM
Level-1-260C-UNLIM
SN74LVTH16374ZRDR
ACTIVE
LFBGA
ZRD
54
SNAGCU
Level-1-260C-UNLIM
SNJ54LVTH16374WD
ACTIVE
CFP
WD
48
TBD
Call TI
Level-NC-NC-NC
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
for the latest availability information and additional product content details.Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Eco
Plan
-
The
planned
eco-friendly
classification:
Pb-Free
(RoHS)
or
Green
(RoHS
&
no
Sb/Br)
-
please
check
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:
The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
4-Oct-2005
Addendum-Page 1
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