
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
LCCC
CFP
LCCC
CDIP
CDIP
CDIP
SOIC
Package
Drawing
FK
W
FK
J
J
J
D
Pins Package
Qty
1
1
1
1
1
1
50
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
5962-86844012A
5962-8684401DA
JM38510/37301B2A
JM38510/37301BCA
SN54ALS02AJ
SN54AS02J
SN74ALS02AD
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
20
14
20
14
14
14
14
None
None
None
None
None
None
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
None
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
None
Pb-Free
(RoHS)
None
None
None
None
None
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CU NIPDAU
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-NC-NC-NC
SN74ALS02ADR
ACTIVE
SOIC
D
14
2500
CU NIPDAU
SN74ALS02AN
ACTIVE
PDIP
N
14
25
CU NIPDAU
SN74ALS02AN3
SN74ALS02ANSR
OBSOLETE
ACTIVE
PDIP
SO
N
NS
14
14
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Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-NC-NC-NC
2000
SN74AS02D
ACTIVE
SOIC
D
14
50
CU NIPDAU
SN74AS02DR
ACTIVE
SOIC
D
14
2500
CU NIPDAU
SN74AS02N
ACTIVE
PDIP
N
14
25
CU NIPDAU
SN74AS02N3
SN74AS02NSR
OBSOLETE
ACTIVE
PDIP
SO
N
NS
14
14
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Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
2000
SNJ54ALS02AFK
SNJ54ALS02AJ
SNJ54ALS02AW
SNJ54AS02FK
SNJ54AS02J
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
LCCC
CDIP
CFP
LCCC
CDIP
FK
J
W
FK
J
20
14
14
20
14
1
1
1
1
1
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(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check
for the latest availability information and additionalproduct content details.
Not yet available Lead (Pb-Free).
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.