
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
LCCC
CDIP
CFP
SSOP
SSOP
Package
Drawing
FK
J
W
DB
DB
Pins Package
Qty
1
1
1
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
5962-9685701Q2A
5962-9685701QRA
5962-9685701QSA
SN74AHC541DBLE
SN74AHC541DBR
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
ACTIVE
20
20
20
20
20
TBD
TBD
TBD
TBD
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
TBD
Pb-Free
(RoHS)
TBD
TBD
TBD
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Call TI
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CU NIPDAU
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Call TI
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-1-250C-UNLIM
2000
SN74AHC541DGVR
ACTIVE
TVSOP
DGV
20
2000
CU NIPDAU
SN74AHC541DW
ACTIVE
SOIC
DW
20
25
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Level-NC-NC-NC
SN74AHC541DWR
ACTIVE
SOIC
DW
20
2000
CU NIPDAU
SN74AHC541N
ACTIVE
PDIP
N
20
20
CU NIPDAU
SN74AHC541NSR
ACTIVE
SO
NS
20
2000
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-1-250C-UNLIM
SN74AHC541PW
ACTIVE
TSSOP
PW
20
70
CU NIPDAU
SN74AHC541PWLE
SN74AHC541PWR
OBSOLETE
ACTIVE
TSSOP
TSSOP
PW
PW
20
20
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CU NIPDAU
Call TI
Level-1-250C-UNLIM
2000
SNJ54AHC541FK
SNJ54AHC541J
SNJ54AHC541W
ACTIVE
ACTIVE
ACTIVE
LCCC
CDIP
CFP
FK
J
W
20
20
20
1
1
1
Call TI
Call TI
Call TI
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
for the latest availability information and additional product content details. The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Eco
Plan
-
The
planned
eco-friendly
classification:
Pb-Free
(RoHS)
or
Green
(RoHS
&
no
Sb/Br)
-
please
check
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:
The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com
30-Mar-2005
Addendum-Page 1