
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
LCCC
CDIP
CFP
SSOP
SSOP
Package
Drawing
FK
J
W
DB
DB
Pins Package
Qty
1
1
1
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
5962-9322001Q2A
5962-9322001QRA
5962-9322001QSA
SN74ABT574ADBLE
SN74ABT574ADBR
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
ACTIVE
20
20
20
20
20
None
None
None
None
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
None
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
None
Pb-Free
(RoHS)
Call TI
Call TI
Call TI
Call TI
CU NIPDAU
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Call TI
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Level-1-240C-UNLIM
Level-NC-NC-NC
2000
SN74ABT574ADW
ACTIVE
SOIC
DW
20
25
CU NIPDAU
SN74ABT574ADWR
ACTIVE
SOIC
DW
20
2000
CU NIPDAU
SN74ABT574AGQNR
SN74ABT574AN
ACTIVE
ACTIVE
VFBGA
PDIP
GQN
N
20
20
1000
20
SNPB
CU NIPDAU
SN74ABT574ANSR
ACTIVE
SO
NS
20
2000
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-1-250C-UNLIM
SN74ABT574APW
ACTIVE
TSSOP
PW
20
70
CU NIPDAU
SN74ABT574APWLE
SN74ABT574APWR
OBSOLETE
ACTIVE
TSSOP
TSSOP
PW
PW
20
20
Call TI
CU NIPDAU
Call TI
Level-1-250C-UNLIM
2000
SN74ABT574ARGYR
ACTIVE
QFN
RGY
20
1000 Green (RoHS &
no Sb/Br)
1000
Pb-Free
(RoHS)
1
1
1
CU NIPDAU
Level-2-260C-1YEAR
SN74ABT574AZQNR
ACTIVE
VFBGA
ZQN
20
SNAGCU
Level-1-260C-UNLIM
SNJ54ABT574FK
SNJ54ABT574J
SNJ54ABT574W
ACTIVE
ACTIVE
ACTIVE
LCCC
CDIP
CFP
FK
J
W
20
20
20
None
None
None
Call TI
Call TI
Call TI
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check
for the latest availability information and additionalproduct content details.
None:
Not yet available Lead (Pb-Free).
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:
The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
PACKAGE OPTION ADDENDUM
www.ti.com
28-Feb-2005
Addendum-Page 1