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參數(shù)資料
| 型號(hào)： | SMPA2010 |
| 英文描述： | 200 TO 2000 MHz TO-8 CASCADABLE AMPLIFIER |
| 中文描述： | 200至2000兆赫至8級(jí)聯(lián)放大器 |
| 文件頁(yè)數(shù)： | 1/1頁(yè) |
| 文件大?。?/td> | 98K |
| 代理商： | SMPA2010 |
PA2010/SMPA2010
200 TO 2000 MHz
TO-8 CASCADABLE AMPLIFIER
Specifications subject to change without notice.
North America: 1-800-366-2266
Visit www.macom.com for complete contact and product information.
Specifications (Rev. Date: 2/02)*
· HIGH POWER OUTPUT: +25.5 dBm (TYP.)
· HIGH THIRD ORDER IP3: +33 dBm (TYP.)
· MODERATE NOISE FIGURE: 5.0 dB (TYP.)
· LOW VSWR: 1.5:1 (TYP.)
Typical Performance @ 25°C
Guaranteed
0
°
to 50
°
C
0.2-2.0 GHz
9.0 dB
±0.7 dB
Characteristics
Typical
-54
°
to +85
°
C
0.2-2.0 GHz
8.5 dB
±1.0 dB
Frequency
Small Signal Gain (min.)
Gain Flatness (max.)
Reverse Isolation
Noise Figure (max.)
Power Output @ 1 dB comp. (min.)
IP3
IP2
Second Order Harmonic IP
VSWR Input / Output (max.)
DC Current @
CPA2010 is a standard PA2010 installed in an SMA connectorized housing and is guaranteed over 0°C
to 50°C with the PA2010's specifications limits of -54°C to+85°C. Measured in a 50-ohm system at +15
Vdc Nominal. Subject to change without notice.
Absolute Maximum Ratings
Storage Temperature
Max. Case Temperature
Max. DC Voltage
Max. Continuous RF Input Power
Max. Short Term RF Input Power (1 minute max.)
Max. Peak Power (3
μ
sec max.)
“S” Series Burn-in Temperature (Case)
Thermal Data: V
cc
=
Thermal Resistance
θ
jc
Transistor Power Dissipation P
d
Junction Temperature Rise Above Case T
jc
Outline Drawings
Package
Figure
Model
TO-8
BG
PA2010
Surface Mount
AA
SMPA2010
SMA Connectorized
CE
CPA2010
0.2-2.4 GHz
10.0 dB
±0.3 dB
20 dB
5.0 dB
25.5 dBm
+33 dBm
+50 dBm
+55 dBm
1.8:1 / 1.5:1
179 mA
23.0 dBm
6.5 dB
23.5 dBm
2.0:1 / 1.8:1
189 mA
1.9:1 / 1.7:1
187 mA
7.0 dB
-62° to +150°C
85°C
+17 Volts
+17 dBm
100 mW
0.5 W
85°C
50°C/W
1.25 W
63°C
15 Volts (max.)
15 Vdc
*
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