
DATA SHEET
PIN DIODE CHIPS SUPPLIED ON FILM FRAME
Skyworks Solutions, Inc. Phone [781] 376-3000 Fax [781] 376-3100 sales@skyworksinc.com www.skyworksinc.com
2
February 21, 2011 Skyworks Proprietary Information Products and Product Information are Subject to Change Without Notice 200140G
Table 1. PIN Diode Chips Absolute Maximum Ratings
Parameter
Symbol
Minimum
Maximum
Units
Reverse voltage
VR
Voltage rating
V
Power dissipation @ 25
°C at the base of
the chip
PD
250
mW
Operating temperature
TOP
–65
+150
°C
Storage temperature
TSTG
–65
+150
°C
Note: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value.
CAUTION: Although these devices are designed to be as robust as possible, Electrostatic Discharge (ESD) can damage them. These
devices must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the
human body or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all
times. PIN diode chips supplied on film frames are Class 1B ESD devices.
Table 2. PIN Diode Chips Electrical Specifications (Note 1)
(TOP = 25
°C)
Part Number
Voltage Rating
(V)
Max CJ
(pF)
VR = 30 V,
f = 1 MHz
Typ VF
(mV)
@ IF = 10 mA
Max RS
(
Ω)
IF = 1 mA,
f = 100 MHz
Max RS
(
Ω)
IF = 10 mA,
f = 100 MHz
Typ TL
(ns)
IF = 10 mA
Switching Applications
SMP1320-099
50
0.175
850
2 typ
0.9
400
SMP1321-099
100
0.150
860
3 typ
2.0
400
SMP1322-099
50
0.850
825
1.5
0.45 typ
400
SMP1340-099
50
0.15 @ 10 V
880
1.7 typ
1.2
100
SMP1353-099
200
0.13 @ 20 V
825
15
2.8
1000
Attenuator Applications
SMP1302-099
200
0.15
800
20
3
700
SMP1304-099
200
0.15
800
50
7
1000
SMP1307-099
200
0.20
850
75 typ
1.5
1500
Note 1: Performance is guaranteed only under the conditions listed in this Table.
Reverse current is specified @ 10
μA maximum at the voltage rating. This voltage should not be exceeded.
The PIN diodes listed here are processed on 100 mm silicon wafers, 100% DC tested, saw cut, and shipped on 6-inch film frame hoops.
Electrical rejects are identified with black ink on the film frame.
Attenuators are 100% series resistance tested @ 1 mA/100 MHz.
Table 3. PIN Diode Chip Dimensions
Part Number
Quantity of Good Diodes Per Wafer
Chip Size
(In)
Chip Height
(In)
Anode Contact
(In)
Minimum
Nominal
SMP1320-099
40000
46000
0.0135 ± 0.001
0.005 ± 0.001
0.0030 ± 0.0003
SMP1321-099
40000
46000
0.0135 ± 0.001
0.005 ± 0.001
0.0030 ± 0.0003
SMP1322-099
40000
46000
0.0135 ± 0.001
0.005 ± 0.001
0.0075 ± 0.0003
SMP1340-099
65000
72000
0.0110 ± 0.001
0.005 ± 0.001
0.0030 ± 0.0003
SMP1353-099
65000
72000
0.0110 ± 0.001
0.005 ± 0.001
0.0080 ± 0.0005
SMP1302-099
40000
46000
0.0135 ± 0.001
0.005 ± 0.001
0.0085 ± 0.0005
SMP1304-099
40000
46000
0.0135 ± 0.001
0.009 ± 0.001
0.0085 ± 0.0005
SMP1307-099
20000
25000
0.0185 ± 0.001
0.009 ± 0.001
0.0110 ± 0.0005