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參數(shù)資料
| 型號(hào)： | SMLP36RGB2W3 |
| 廠商： | Rohm Semiconductor |
| 文件頁數(shù)： | 5/7頁 |
| 文件大?。?/td> | 530K |
| 描述： | LED PICOLED RGB 5MA 1510 |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | PicoLED™ |
| 顏色： | 紅，綠，藍(lán)（RGB） |
| Millicandela 等級(jí)： | 35mcd 紅，110mcd 綠，45mcd 藍(lán) |
| 正向電壓： | 2.2V 紅，3.3V 綠，3.2V 藍(lán) |
| 電流 - 測試： | 20mA |
| 波長 - 主： | 624nm，527nm，470nm |
| 透鏡類型： | 散射，白色 |
| 透鏡樣式/尺寸： | 矩形，帶平頂，1.5mm x 0.6mm |
| 封裝/外殼： | 0604（1510 公制） |
| 尺寸/尺寸： | 1.50mm L x 1.00mm W |
| 高度： | 0.20mm |
| 安裝類型： | 表面貼裝 |
| 包裝： | 標(biāo)準(zhǔn)包裝 |
| 其它名稱： | 846-1097-6 |
www.rohm.com
?2014 ROHM Co., Ltd. All rights reserved.
Data Sheet
SMLP36 series
lAttention Points In Handlin
This product was developed as a surface mount LED especially suitable for reflow soldering.
Please take care of following points when using this device.
1.DESIGNING OF PCB
As for a recommendable solder pattern, Please refer to Fig-1.
The size and direction of the pad pattern depends on the condition of the PCB,
horough design review is recommended before the final designing.
his product of structured with rear/bottom electrode to be soldered.
The formation of solder fillet is not guaranteed due to its electrode shape
.SOLDERING Sn-Cu Sn-A -Cu Sn-A -Bi-Cu
LED products do not contain reinforcement
materials such as glass fillers.
Therefore, thermal stress by soldering greatly
influence its reliability.
The temperature conditions for reflow soldering
should therefore be set up according to the
characteristic of this product. (See Fig-2)
Number of reflow process shall be max 2 times
and these processes shall be performed in a row.
Cooling process to normal temperature shall be required
between first and second soldering process.
.HANDLING AFTER MOUNTING (Fig.-3)
As shown in the drawing on the right, in case outside force of
about 700g is given to the device, stress is concentrated to the jointed part
between mold resin and substrate.
Therefore there is a possibility to breath the device or PCB.
Careful handing is needed as ROHM cannot guarantee the falling
of the device by outside force after mounting.
.WASHING
Please note the following points when washing is required after soldering.
4-1) WASHING SOLVENT
sopropyl alcohol or other alcohol solvent is recommendable.
4-2) TEMPERATURE
Below 30篊, immersion time ; within 3 minutes.
4-3) ULTRA SONIC WASHING
Below 15/1 litter of solvent tub or less.
4-4) COOLING
Below 100篊 within 3 minutes.
0
.
4
5
0
.
2
5
0
.
2
5
0
.
4
5
0
.
4
Min.1 min Max. 40sec
Max.260篊, Within 10sec
140 to 180篊
230 to 260篊
(Fig-1)
(Fig-2)
Mask open area ratio : 80%
Mask thickness : 80 to 100mm
Reference
Substrate
Outside
Force
PCB
Mold
Soldering part
Emitting
Direction
(Fig-3)
5/6
2014.02 - Rev.G
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| SMLP36RGB2W3R | 功能描述:Red, Green, Blue (RGB) 624nm Red, 527nm Green, 470nm Blue LED Indication - Discrete 2.1V Red, 3.1V Green, 3V Blue 0604 (1510 Metric) 制造商:rohm semiconductor 系列:PicoLED?? 包裝:剪切帶（CT） 零件狀態(tài):有效 顏色:紅，綠，藍(lán)（RGB） 透鏡顏色:白 透鏡透明度:散射 毫燭光等級(jí):35mcd 紅，110mcd 綠，35mcd 藍(lán) 透鏡樣式/尺寸:矩形，帶平頂，1.50mm x 0.60mm 電壓 - 正向（Vf）（典型值）:2.1V 紅，3.1V 綠，3V 藍(lán) 電流 - 測試:5mA 紅，5mA 綠，5mA 藍(lán) 視角:- 安裝類型:表面貼裝 波長 - 主:624nm 紅，527nm 綠，470nm 藍(lán) 波長 - 峰值:- 特性:- 封裝/外殼:0604（1510 公制） 供應(yīng)商器件封裝:1510（0604） 大小/尺寸:1.50mm 長 x 1.00mm 寬 高度（最大值）:0.25mm 標(biāo)準(zhǔn)包裝:1 |
| SM-LP-5000E | 功能描述:變壓器音頻和信號(hào) MAGNETICS - LINE-MATCHING TRANSFORMER RoHS:否 制造商:Skyworks Solutions, Inc. 頻率范圍:810 MHz to 960 MHz 初級(jí)線圈阻抗: 次級(jí)線圈阻抗: 絕緣電壓:23 dB 工作溫度范圍:- 40 C to + 85 C 端接類型:SMD/SMT 尺寸:6 mm L x 4.9 mm W x 1.6 mm H 產(chǎn)品:Splitters and Combiners |
| SMLP5001 | 制造商:BOURNS 制造商全稱:Bourns Electronic Solutions 功能描述:Surface Mount Line Matching Transformers |
| SM-LP5001 | 制造商:Bourns Inc 功能描述:LINE MATCHING TRANSFORMER |
| SM-LP-5001 | 功能描述:變壓器音頻和信號(hào) 600uH 7.36mm SMT Line Matching RoHS:否 制造商:Skyworks Solutions, Inc. 頻率范圍:810 MHz to 960 MHz 初級(jí)線圈阻抗: 次級(jí)線圈阻抗: 絕緣電壓:23 dB 工作溫度范圍:- 40 C to + 85 C 端接類型:SMD/SMT 尺寸:6 mm L x 4.9 mm W x 1.6 mm H 產(chǎn)品:Splitters and Combiners |
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