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參數(shù)資料
| 型號(hào)： | SMDA12C.T |
| 元件分類： | TVS二極管 - 瞬態(tài)電壓抑制 |
| 英文描述： | 300 W, BIDIRECTIONAL, 8 ELEMENT, SILICON, TVS DIODE, MS-012AA |
| 封裝： | LEAD FREE, SOP-8 |
| 文件頁(yè)數(shù)： | 5/7頁(yè) |
| 文件大?。?/td> | 180K |
| 代理商： | SMDA12C.T |
5
2005 Semtech Corp.
www.semtech.com
PROTECTION PRODUCTS
SMDA05C THRU SMDA24C
Circuit Diagram
I/O Line Protection
Device Connection for Protection of Four Data Lines
The SMDAxxC series of devices are designed to protect
up to four data lines. The devices are connected as
follows:
The SMDAxxC are bidirectional devices and are
designed for use on lines where the normal operat-
ing voltage is above and below ground. Pins 1, 2,
3, and 4 are connected to the protected lines.
Pins 5, 6, 7, and 8 are connected to ground. Since
the device is electrically symmetrical, these connec-
tions may be reversed. The ground connections
should be made directly to the ground plane for
best results. The path length is kept as short as
possible to reduce the effects of parasitic induc-
tance in the board traces.
Circuit Board Layout Recommendations for Suppres-
sion of ESD.
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
Place the TVS near the input terminals or connec-
tors to restrict transient coupling.
Minimize the path length between the TVS and the
protected line.
Minimize all conductive loops including power and
ground loops.
The ESD transient return path to ground should be
kept as short as possible.
Never run critical signals near board edges.
Use ground planes whenever possible.
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small com-
pared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
1
2
3
45
6
7
8
Ground
From Connector
To Protected
Device
Typical Connection
1
2
3
45
6
7
8
Applications Information
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| SMDA15C.TBT | 300 W, BIDIRECTIONAL, 8 ELEMENT, SILICON, TVS DIODE, MS-012AA |
| SMDA24C.TB | 300 W, BIDIRECTIONAL, 8 ELEMENT, SILICON, TVS DIODE, MS-012AA |
| SMDA15C | 300 W, BIDIRECTIONAL, 8 ELEMENT, SILICON, TVS DIODE, MS-012AA |
| SMDA24C.T | 300 W, BIDIRECTIONAL, 8 ELEMENT, SILICON, TVS DIODE, MS-012AA |
| SMDA12C | 300 W, BIDIRECTIONAL, 8 ELEMENT, SILICON, TVS DIODE, MS-012AA |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SMDA12C-T7 | 制造商:ProTek Devices 功能描述:ESD Suppressor TVS 15KV 8-Pin SO T/R |
| SMDA12CTB | 制造商:Semtech Corporation 功能描述: |
| SMDA12CTR | 功能描述:TVS DIODE 12VWM 13.3VC 8SO 制造商:smc diode solutions 系列:- 包裝:剪切帶（CT） 零件狀態(tài):在售 類型:齊納 單向通道:- 雙向通道:4 電壓 - 反向關(guān)態(tài)（典型值）:12V（最大） 電壓 - 擊穿（最小值）:13.3V 電壓 - 箝位（最大值）@ Ipp:19V 電流 - 峰值脈沖（10/1000μs）:- 功率 - 峰值脈沖:300W 電源線路保護(hù):無(wú) 應(yīng)用:通用 不同頻率時(shí)的電容:94pF @ 1MHz 工作溫度:-55°C ~ 125°C（TJ） 安裝類型:表面貼裝 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商器件封裝:8-SO 標(biāo)準(zhǔn)包裝:1 |
| SMDA12E3/TR13 | 制造商:Microsemi Corporation 功能描述:4 LINE UNI-DIR, 300W (8/20US), STAND-OFF VOLTAGE = 12V - Tape and Reel 制造商:Microsemi Corporation 功能描述:TVS DIODE 12VWM 19VC 8SOIC |
| SMDA12E3/TR7 | 制造商:Microsemi Corporation 功能描述:4 LINE UNI-DIR, 300W (8/20US), STAND-OFF VOLTAGE = 12V - Tape and Reel 制造商:Microsemi Corporation 功能描述:TVS DIODE 12VWM 19VC 8SOIC |
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